LED Indication - Discrete

Part Number	Description / PDF	Quantity
5219974F Dialight	LED WHITE CLEAR 5MM T/H	0
5219985F Dialight	LED GREEN CLEAR T-1 T/H	0
5988C60107F Dialight	SM MINI PLCC2 YG 570NM	9000
5977741007F Dialight	SURFACE MOUNT LED PLCC 0G 7 REEL	0
5510804812F Dialight	LED CBI 3MM BLUE RA	0
5219724F Dialight	LED GREEN/YELLOW DIFF 5MM T/H	0
5218396F Dialight	5MM R/G 3 LEADED COM CATHODE	0
5973323302F Dialight	LED GREEN CLEAR 2PLCC SMD	0
5977711307F Dialight	LED RGB CLEAR 4SMD	0
5988C80107F Dialight	SM MINI PLCC2 GRN 525NM	9145
5977721802F Dialight	LED 4PLCC SMD	0
5972732607F Dialight	SM RTANG Y R 3.2X1.6X1MM 7RL	0
5973211607F Dialight	LED ORANGE CLEAR 2PLCC SMD	0
5219610F Dialight	LED DISCRETE INDICATOR	0
5219183 Dialight	LED T-1 3/4 T/H	0
5973901837F Dialight	LED WHITE 7 REEL SMD	0
5973224307F Dialight	LED AMBER CLEAR SMD	0
5988C40107F Dialight	SM MINI PLCC2 YEL 590NM	5931
5219724801F Dialight	LED GREEN RED DIFFUSED 5MM T/H	0
5218089F Dialight	LED AMBER CLEAR T-1 3/4 T/H	0

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials