Fiber Optics - Transceiver Modules

Image Part Number Description / PDF Quantity Rfq
HFBR-5208AEMZ

HFBR-5208AEMZ

Broadcom

TXRX 1X9 622MB/S FP METAL HOUSE

0

AFCT-57D5ATPZ

AFCT-57D5ATPZ

Broadcom

TXRX OPT SFP OBSAI/CPRI SM

0

AFBR-5103PZ

AFBR-5103PZ

Broadcom

TXRX 127MBD DUPLEX SC 1X9 MEZZ

0

AFBR-5205AZ

AFBR-5205AZ

Broadcom

TXRX ATM/SONET/OC-3 SC 1X9

0

HFBR-7924WZ

HFBR-7924WZ

Broadcom

TXRX 4+4 2.7GBD PLUGGABLE PAR

0

AFCT-5942ATLZ

AFCT-5942ATLZ

Broadcom

TXRX OPT SM SFF SONET OC48/SDH

0

HFBR-5208AFMZ

HFBR-5208AFMZ

Broadcom

TXRX 1X9 622MB/S SR METAL HOUSE

0

AFBR-5103AZ

AFBR-5103AZ

Broadcom

TXRX 127MBD DUPLEX SC 1X9

0

HFBR-7934EWZ

HFBR-7934EWZ

Broadcom

TXRX 4+4 3GBD PLUGGABLE EMI

0

AFBR-79E4Z-D

AFBR-79E4Z-D

Broadcom

TXRX QSFP 40G 4CH PLUGGABL W/DMI

0

Fiber Optics - Transceiver Modules

1. Overview

Fiber optic transceiver modules are compact devices that integrate optical transmitters and receivers to enable bidirectional data transmission over fiber optic cables. These modules convert electrical signals to optical signals (and vice versa) using laser diodes and photodetectors. They play a critical role in modern high-speed communication systems, supporting applications ranging from telecommunications to data center infrastructure. Their miniaturized design and standardized interfaces (e.g., SFP, QSFP) have revolutionized scalable network architecture deployment.

2. Main Types and Functional Classification

TypeTransmission RateWavelengthTransmission DistanceApplication Example
SFP100Mbps-1Gbps850nm(MMF)/1310nm(SMF)550m-2kmEnterprise LAN switches
SFP+1-10Gbps1270-1330nm100m-120km10GbE data centers
QSFP40Gbps1270-1330nm2km-2kmHigh-performance computing clusters
CFP100Gbps-400Gbps1270-1330nm500m-120kmLong-haul optical transport
QSFP28100Gbps1270-1330nm100m-2kmCloud data center backbone

3. Structure and Components

A typical transceiver module consists of:

  • Optical sub-assembly (OSA) with TOSA (Transmitter Optical Sub-Assembly) and ROSA (Receiver Optical Sub-Assembly)
  • Electrical interface (e.g., LC, MPO connectors)
  • Digital diagnostic monitoring (DDM) circuitry
  • Thermal management components
  • Compliance with industry standards (IEEE 802.3, SFF-8431)
The housing provides EMI shielding and mechanical protection while maintaining hot-pluggable functionality.

4. Key Technical Specifications

ParameterDescriptionImportance
Transmission RateData throughput capacity (Gbps)Determines network bandwidth
Optical WavelengthOperating frequency (nm)Matches fiber type and multiplexing scheme
Receiver SensitivityMinimum detectable optical power (dBm)Impacts link budget and distance
Power ConsumptionOperational energy usage (W)Affects cooling requirements and costs
Operating TemperatureFunctional range (-40 C to +85 C)Determines environmental suitability

5. Application Fields

Key industries include:

  • Telecommunications (5G networks, metro access)
  • Data centers (switch interconnects, storage area networks)
  • Industrial automation (real-time sensor networks)
  • Medical imaging (high-resolution video transmission)
  • Aerospace (avionics data links)
Typical equipment: Cisco Catalyst switches, Huawei OptiX routers, InfiniBand HCAs.

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
FinisarCFP2-100G-LR4100Gbps, 2km reach, low power
Sumitomo ElectricQSFP-100G-ER440km transmission, DWDM support
Source PhotonicsSFP28-25G-LR25Gbps, 2km, CPRI applications
LumentumQSFP28-ZR100Gbps, 80km, coherent optics

7. Selection Recommendations

Key considerations:

  • Match data rate requirements with protocol standards (Ethernet, Fibre Channel)
  • Evaluate fiber type compatibility (MMF/SMF) and connector types
  • Assess power budget and thermal management needs
  • Consider digital diagnostics for network monitoring
  • Verify compliance with industry standards
  • Plan for future scalability (e.g., 400G readiness)
Case study: Deploying QSFP28-100G-SR4 modules in a hyperscale data center achieved 50% lower latency compared to 40G solutions.

8. Industry Trends

Emerging developments:

  • Transition to 400G/800G modules using 100G per lane electrical interfaces
  • Adoption of silicon photonics for cost reduction
  • Integration of PAM4 modulation for higher spectral efficiency
  • Embedded optics in switch ASICs for reduced latency
  • Co-packaged optics for advanced thermal management
  • Increased focus on energy efficiency ( 2W per 100G lane)
Market forecasts predict a CAGR of 12.3% from 2023-2030, driven by AI/ML infrastructure demands.

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