Accessories

Image Part Number Description / PDF Quantity Rfq
0358431215

0358431215

Woodhead - Molex

PT BULB S-B ASS'Y G

0

1041330217

1041330217

Woodhead - Molex

WY21W T20 BULB SOCKET BROWN

0

1301060188

1301060188

Woodhead - Molex

STRNGLT 80' #10/3 BLK, 20(323) 3

0

1801920000

1801920000

Woodhead - Molex

LENS/COVER CL-L340 CLEAR

0

0353400210

0353400210

Woodhead - Molex

FSM BULB SOCKET

0

0358431226

0358431226

Woodhead - Molex

PT BULB S-C ASS'Y W

0

0681470215

0681470215

Woodhead - Molex

LICENSE LAMP SOCKET

196

1301060166

1301060166

Woodhead - Molex

STRNGLT 281.25' 12/3 18 62'LEAD

0

1046110311

1046110311

Woodhead - Molex

WT21 BULB SOCKET ASSY A TYPE

0

0353410210

0353410210

Woodhead - Molex

STS BULB SOCKET 2POS

0

1801800001

1801800001

Woodhead - Molex

RS LED HOLDER WITH COVER

0

1301060151

1301060151

Woodhead - Molex

STRNGLT 212.75' 12-3 60 20' LEAD

0

1046110341

1046110341

Woodhead - Molex

WT21 BULB SOCKET ASSY D TYPE

0

1301060183

1301060183

Woodhead - Molex

10-LANTERN STRINGLITE CORD SET B

0

1301060156

1301060156

Woodhead - Molex

MOLED T-SPLICE 10-393, 25'LD W/1

0

1301070029

1301070029

Woodhead - Molex

STRING LIGHT LAMPHOLDER

0

0358431206

0358431206

Woodhead - Molex

PT BULB S-A ASS'Y W

0

0358431247

0358431247

Woodhead - Molex

SEALED PT BULB S-D BROWN

0

0358421306

0358421306

Woodhead - Molex

PT BULB D-A ASSY W

0

1041340211

1041340211

Woodhead - Molex

W21W T20 BULB SOCKET BLACK

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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