Accessories

Image Part Number Description / PDF Quantity Rfq
085131001301

085131001301

Dialight

PMI BASE 11/16 INCAND BAY SCREW

0

047090129300

047090129300

Dialight

PMI BASE 1INCAND S6 CNDLBR SCRW

0

162843009600

162843009600

Dialight

PMI BASE 15/32 INCAND MIDG SLDR

0

037040801270

037040801270

Dialight

PMI BASE 9/16 NEON T-3 1/4 SLDR

0

1132934200

1132934200

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PMI CAP BLUE 15/32 MOUNT HOLE

0

2230333203

2230333203

Dialight

PMI IND CAP SUB MINI YELLOW

0

081946301370

081946301370

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

026836311372

026836311372

Dialight

PMI BASE NEON 11/16 T-3 1/4 QC

0

051320601807

051320601807

Dialight

PMI BASE INDICATOR 1 ASSY

0

095571009101

095571009101

Dialight

PMI BASE 11/16 INCAND BAY QC

0

080340605300

080340605300

Dialight

PMI BASE 1 INCAND G-6 BAY SLDR

0

1090132200

1090132200

Dialight

PMI T-1 3/4 INCAND GREEN UNFROST

0

061131002300

061131002300

Dialight

PMI BASE 1INCAN T3 1/4 BAY SCRW

0

095946309263

095946309263

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

169936311363

169936311363

Dialight

PMI BASE 11/16 NEON BAY SCREW

0

169946311360

169946311360

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

080670105303

080670105303

Dialight

PMI BASE 1 INCAND S-6 CNDLBR QC

0

047400129301

047400129301

Dialight

PMI BASE 1INCAND S6 CNDLBR SLDR

0

047350229301

047350229301

Dialight

PMI BASE 1 INCAND S-6 BAY SCREW

0

5151059F

5151059F

Dialight

MOUNT/ALIGN BRKT DUAL 16ELEMENT

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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