Accessories

Image Part Number Description / PDF Quantity Rfq
3320013

3320013

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SWITCH CAP YELLOW

0

051320601303

051320601303

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PMI BASE 1 INCAND G-6 BAY SCREW

0

1110111300

1110111300

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PMI T-1 3/4 INCAND RED FROSTED

0

085571001403

085571001403

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PMI BASE 11/16 INCAND BAY QC

0

019340605300

019340605300

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PMI BASE G-6 BAYO 1 INCAND SLDR

0

1371533

1371533

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PMI CAP CYLIND YLW 15/32 TRANSP

0

5270005

5270005

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PMI IND PRESS TO TEST

0

041091401101

041091401101

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PMI BASE 1 NEON T-4 1/2 CANDLBR

0

026041011303

026041011303

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PMI BASE BAYO 11/16 INCAND SLDR

0

031090101102

031090101102

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PMI BASE 1 INCAND S6 CANDELBRA

0

104320202103

104320202103

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PMI BASE 1 INCAND S-6 BAY SCREW

0

061131002303

061131002303

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PMI BASE 1INCAN T3 1/4 BAY SCRW

0

081040801140

081040801140

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PMI BASE 11/16 NEON BAY SOLDER

0

205221001500

205221001500

Dialight

PMI BASE 11/16 INCAND BAY SLDR

0

080401405301

080401405301

Dialight

PMI BASE 1 NEON CNDLBR SOLDER

0

080401409303

080401409303

Dialight

PMI BASE 1 NEON CNDLBR SOLDER

0

019320605301

019320605301

Dialight

PMI BASE G-6 BAYO 1 INCAND SCRW

0

080091409301

080091409301

Dialight

PMI BASE 1 NEON CNDLBR SCREW

0

095130809371

095130809371

Dialight

PMI BASE 11/16 NEON BAY SCREW

0

026136311310

026136311310

Dialight

PMI BASE NEON 11/16 T-3 1/4 BAY

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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