Accessories

Image Part Number Description / PDF Quantity Rfq
095911009302

095911009302

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PMI BASE 11/16 INCAND BAY SOLDER

0

2390334500

2390334500

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PMI IND CAP SUB MINI FLAT BLUE

0

026586311363

026586311363

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PMI BASE NEON 11/16 T-3 1/4 QC

0

CL2FLXUK

CL2FLXUK

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CL2 FLEX CABLE

0

033042801305

033042801305

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PMI BASE 9/16 INCAND T-2 SLDR

0

1787575500

1787575500

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PMI PANEL MNT IND WHITE SUB MINI

0

9905000013

9905000013

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LED ACCESSORY O RING

0

CT210024

CT210024

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2 WAY LINK LEAD 100MM 24AWG

0

095916309110

095916309110

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PMI BASE 11/16 NEON BAY SOLDER

0

2090131203

2090131203

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PMI CONVEX CAP SIZE 1 RED TRANSP

0

1340334200

1340334200

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PMI CAP BLUE FLAT 15/32 TRANSP

0

095916309112

095916309112

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

CT220024

CT220024

Dialight

2 WAY LINK LEAD 200MM 24AWG

0

061320202203

061320202203

Dialight

PMI BASE 1INCAND S-6 BAYO SCREW

0

2090112203

2090112203

Dialight

PMI PANEL INDICATOR LARGE

0

L2KL7K2

L2KL7K2

Dialight

KIT EVAL FOR LUXEON K2 LEDS

0

3320015

3320015

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SWITCH CAP WHITE

0

1691113300

1691113300

Dialight

PMI CAP STOVEP YLW 11/16 FROSTED

0

1370936

1370936

Dialight

PMI CAP STOVE LT YW 15/32 TRANSP

0

047320229300

047320229300

Dialight

PMI BASE 1 INCAND S-6 BAY SCREW

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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