Accessories

Image Part Number Description / PDF Quantity Rfq
101503009203

101503009203

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PMI BASE 15/32 INCAND MIDG SLDR

0

047090129201

047090129201

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PMI BASE 1INCAND S6 CNDLBR SCRW

0

026046311213

026046311213

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PMI BASE NEON 11/16 INCAND SLDR

0

021041029300

021041029300

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PMI BASE 11/16 INCAND SOLDER

0

080571005301

080571005301

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PMI BASE 1INCAN T-3 1/4 BAYO QC

0

026131011200

026131011200

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PMI BASE 11/16 INCAN T-3 1/4 BAY

0

081105901300

081105901300

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PMI BASE 11/16 T2 SLIDE AMP CONN

0

051670101301

051670101301

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PMI BASE 1 INCAND S-6 CNDLBR QC

0

1691135303

1691135303

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PMI CAP STOVEP WHT 11/16 TRANSP

0

070041011305

070041011305

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PMI BASE 9/16 INCAND BAY SOLDER

0

019320205401

019320205401

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PMI BASE S-6 BAYO 1 INCAND SCRW

0

103400105103

103400105103

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PMI BASE 1INCAN S-6 CNDLBR SLDR

0

051320601300

051320601300

Dialight

PMI BASE 1 INCAND G-6 BAY SCREW

0

1340111200

1340111200

Dialight

PMI CAP CONVEX RED 15/32 FROST

0

081041001200

081041001200

Dialight

PMI BASE 11/16 INCAND BAY SOLDER

0

019400105301

019400105301

Dialight

PMI BASE S-6 CAND 1 INCAND SLDR

0

095936309162

095936309162

Dialight

PMI BASE 11/16 NEON BAY SCREW

0

080350205300

080350205300

Dialight

PMI BASE 1 INCAND S-6 BAY SCREW

0

169041011203

169041011203

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PMI BASE 11/16 INCAND BAY SOLDER

0

251874515504

251874515504

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ACCY DATALAMP HOLDER

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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