| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Bridgetek |
FULL DUPLEX UART BRIDGE 5M BAUD |
0 |
|
 |
TE Connectivity AMP Connectors |
COVER, LIGHT CONTROLLER,76MM DIA |
86 |
|
 |
Visual Communications Company, LLC |
PMI .290" SOCKET SOLDER TERM SMO |
21 |
|
 |
Visual Communications Company, LLC |
LED RETAINING RING 5MM |
77060 |
|
 |
LUXTECH |
10MM FLEX RGB WIRE-TO-BOARD CONN |
22 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE Z50 HOLDER 2828 GENERAL |
5420 |
|
 |
Jabil |
DUAL MINI EDFA SPECIFICATION |
0 |
|
 |
Visual Communications Company, LLC |
LED CONN CBL ASSY 5MM |
0 |
|
 |
Jabil |
EDFA-PRE FGA 2020 FOR GPP |
0 |
|
 |
Digital View Inc. |
CABLE BACKLGT FLYING LEAD 5WAY |
0 |
|
 |
Phoenix Contact |
POWER CABLE 3M |
2258 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE Z45 LED HOLDER FOR COUN |
608 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE DRIVE Z50- ON/OFF, 0.35 |
319 |
|
 |
Electronic Assembly (Display Visions) |
TOUCHPANEL CAP FOR DOG/OLED 28-6 |
6 |
|
 |
JKL Components Corporation |
2 METER DOUBLE WIDE LED CHANNEL |
2 |
|
 |
Industrial Fiber Optics, Inc. |
MNT HORIZ T1 LED TO LIGHT PIPE |
0 |
|
 |
Newhaven Display, Intl. |
PCB ADAPTER 26P 1MM FFC-THRUHOLE |
5 |
|
 |
Khatod |
GASKET FOR SMILE |
26 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE DRIVE Z50- ON/OFF, 0.5A |
20 |
|
 |
Digital View Inc. |
CABLE PANEL LVDS 460MM SERIES2 |
0 |
|
Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.
| Type | Functional Features | Application Examples |
|---|---|---|
| Optical Connectors | Secure fiber alignment, low insertion loss | Telecom networks, data centers |
| Optical Couplers | Split/combine light signals | PON networks, sensing systems |
| Optical Isolators | Prevent back-reflection interference | Laser protection, high-speed transceivers |
| Optical Attenuators | Control signal power levels | EDFA amplifiers, FTTH networks |
| Photodetector Modules | Convert optical to electrical signals | LiDAR, optical sensors |
Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)
| Parameter | Significance |
|---|---|
| Wavelength Range (nm) | Determines compatibility with light sources (e.g., 1260-1650nm for telecom) |
| Insertion Loss (dB) | Measures signal power loss through the component |
| Return Loss (dB) | Indicates reflection suppression capability |
| Operating Temperature ( C) | Defines environmental tolerance (-40 to +85 C typical) |
| Optical Power Handling (mW) | Maximum power without performance degradation |
Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)
| Manufacturer | Representative Products |
|---|---|
| Finisar (II-VI) | FMT series optical transceivers |
| Avago Technologies | HFBR series fiber optic modules |
| Lumentum | WaveReady optical components |
| Hamamatsu Photonics | G12157 photodetector arrays |
Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments
Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste