| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Electronic Assembly (Display Visions) |
LED BACKLIT F. EA DOGS104 |
30 |
|
 |
LEDiL |
BASE PART ROUND 1 POS 44MM (D) 5 |
0 |
|
 |
Woodhead - Molex |
DIODE RECT 16KV 2A SMD |
0 |
|
 |
RAFI |
RAFIX 22 FS+ LED-CLIP 24V BLUE |
6 |
|
 |
LEDdynamics, Inc. |
ADAPTER RJ45 FEM-3PIN XLR 4016 |
0 |
|
 |
TE Connectivity AMP Connectors |
LED TO BOARD W/OPTICS LATCH |
86 |
|
 |
Phoenix Contact |
FO SPLICE BOX 6 LC DUPLEX |
11 |
|
 |
Finisar Corporation |
CHASSIS 19X10.52X1.7 BLACK |
0 |
|
 |
Visual Communications Company, LLC |
5MM TRI-LEAD CABLE ASSY |
0 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE LED HOLDER Z50 LOW PROF |
11 |
|
 |
Visual Communications Company, LLC |
LED CONN CBL ASSY 5MM 3LD |
309 |
|
 |
JKL Components Corporation |
ALUMINUM LED CHANNEL KIT, NARROW |
1 |
|
 |
LED Lighting Inc. |
CONNECT LED TO LED SECTION |
280 |
|
 |
LEDiL |
BASE PART ROUND 1 POS 44MM (D) 5 |
0 |
|
 |
TE Connectivity AMP Connectors |
LUMAWISE LED HOLDER |
1398 |
|
 |
Electronic Assembly (Display Visions) |
1X10 PIN SOCKET |
8 |
|
 |
Banner Engineering |
BRACKET FOR USE WITH WLC60 |
2 |
|
 |
JKL Components Corporation |
FLEX X SHAPED JOINER CONN |
0 |
|
 |
3M |
FILM ADV LT CONTRL 12X11.5 10 PC |
0 |
|
 |
JKL Components Corporation |
ALUMINUM LED CHANNEL KIT- CORNER |
3 |
|
Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.
| Type | Functional Features | Application Examples |
|---|---|---|
| Optical Connectors | Secure fiber alignment, low insertion loss | Telecom networks, data centers |
| Optical Couplers | Split/combine light signals | PON networks, sensing systems |
| Optical Isolators | Prevent back-reflection interference | Laser protection, high-speed transceivers |
| Optical Attenuators | Control signal power levels | EDFA amplifiers, FTTH networks |
| Photodetector Modules | Convert optical to electrical signals | LiDAR, optical sensors |
Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)
| Parameter | Significance |
|---|---|
| Wavelength Range (nm) | Determines compatibility with light sources (e.g., 1260-1650nm for telecom) |
| Insertion Loss (dB) | Measures signal power loss through the component |
| Return Loss (dB) | Indicates reflection suppression capability |
| Operating Temperature ( C) | Defines environmental tolerance (-40 to +85 C typical) |
| Optical Power Handling (mW) | Maximum power without performance degradation |
Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)
| Manufacturer | Representative Products |
|---|---|
| Finisar (II-VI) | FMT series optical transceivers |
| Avago Technologies | HFBR series fiber optic modules |
| Lumentum | WaveReady optical components |
| Hamamatsu Photonics | G12157 photodetector arrays |
Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments
Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste