| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
TE Connectivity AMP Connectors |
ADAPTER 2.50MM UNIV MICROSCOPE |
0 |
|
|
TE Connectivity AMP Connectors |
FC/APC ADAPTER MICROSCOPE 20X |
0 |
|
|
Aven |
REPLACEMENT LENS FOR 26508 SERIE |
0 |
|
|
TE Connectivity AMP Connectors |
MICROSCOPE ADAPTER FO7 |
0 |
|
|
TE Connectivity AMP Connectors |
SC/APC ADAPTER MICROSCOPE 10X |
0 |
|
|
Panasonic |
CONTROLLER WITH MONITOR |
0 |
|
|
TE Connectivity AMP Connectors |
MICROSCOPE ADAPTER LIGHTRAY MPO |
0 |
|
|
Panasonic |
SCOPE: FIXED CABLE 1500MM |
0 |
|
|
Excelitas Technologies |
A-ZM MICRO ,POLARIZER |
0 |
|
|
Tronex (Menda/EasyBraid/Tronex) |
VPI MIRRORED TIP ASSY 3PCS |
0 |
|
|
Aven |
BULB 9 WATT BLACK |
1 |
|
|
Tronex (Menda/EasyBraid/Tronex) |
FIBER OPTIC LENS 2PCS |
0 |
|
|
Aven |
GLIDING STAGE 350MM X 250MM |
0 |
|
|
FLIR |
CAMERA TIP KITS FOR 8.0MM CAMS |
0 |
|
|
Aven |
ADAPTER PLATE FOR MICRO LENS |
1 |
|
|
TE Connectivity AMP Connectors |
MPX MICROSCOPE ADAPTER |
0 |
|
|
Panasonic |
SCOPE: FLEXIBLE CABLE 1500MM |
0 |
|
|
Aven |
SOFTWRE PC LINK FOR 26700-106 |
1 |
|
|
TE Connectivity AMP Connectors |
MICROSC ADAPT LIGHTRAY MT-RJ |
0 |
|
|
Aven |
WEIGHTED BASE FOR MAG LAMPS |
1 |
|
Optical inspection equipment accessories are modular components that enhance the functionality, precision, and adaptability of optical inspection systems. These accessories include illumination sources, lenses, sensors, filters, and software modules. They play a critical role in industrial quality control, semiconductor manufacturing, biomedical imaging, and precision measurement by enabling accurate defect detection, dimensional analysis, and material characterization.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| High-Intensity LED Lighting | Uniform illumination, adjustable wavelength, low thermal emission | Surface defect detection in PCB manufacturing |
| Telecentric Lenses | Minimize perspective errors, maintain constant magnification | Precision metrology in semiconductor wafer inspection |
| Hyperspectral Imaging Sensors | Capture spectral and spatial data simultaneously | Material analysis in food quality control |
| Optical Filters | Selective wavelength transmission/reflection | Fluorescence imaging in biomedical diagnostics |
| Motorized XY Stages | High-precision positioning with sub-micron resolution | Automated sample scanning in R&D laboratories |
A typical accessory system consists of:
- Mechanical housing with vibration-damping mounts
- Optical components (lenses, prisms, diffraction gratings)
- Electronic control units with interface ports (USB 3.0, GigE Vision)
- Calibration modules for environmental compensation
- Software development kits (SDKs) for system integration
| Parameter | Description | Importance |
|---|---|---|
| Resolution | Minimum detectable feature size (1-10 m range) | Determines defect detection capability |
| Wavelength Range | Operational spectral band (UV-VIS-NIR: 200-2500 nm) | Material interaction specificity |
| Working Distance | Optimal object-to-lens distance (10-200 mm) | System design flexibility |
| Data Transfer Rate | Up to 10 Gbps via CoaXPress interfaces | Real-time inspection throughput |
| Environmental Tolerance | Operating temperature (0-50 C), humidity resistance | System reliability in industrial settings |
| Manufacturer | Product Series | Key Specifications |
|---|---|---|
| Keyence | CV-X4 Series Controllers | Multi-sensor fusion, 0.1 m resolution |
| Cognex | DVT Summit Series | Embedded vision systems with AI algorithms |
| Olympus | Stream Essentials Software | 3D surface analysis for metallurgy |
| CCS Opto | LDR2-50SW2 Lighting | Strobe synchronization at 50,000 lx output |
Key considerations include:
- Matching numerical aperture (NA) with required depth of field
- Spectral compatibility between light sources and sensors
- Environmental sealing (IP ratings for dusty/humid environments)
- Software API compatibility with existing automation systems
- Calibration certification (NIST traceability preferred)
Current development trends include:
- Integration of AI-powered defect classification algorithms
- Miniaturization through MEMS-based optical components
- Multi-spectral imaging combining visible and thermal IR bands
- Standardization of plug-and-play interfaces (USB4 Vision, XCP)