Memory - Modules

Part Number	Description / PDF	Quantity
MTA36ASF8G72LZ-2G9B1 Micron Technology	DDR4 64GB LRDIMM	100
AW56M7258BKH9M ATP Electronics, Inc.	MEMORY MODULE 2GB 204RDIMM	0
A4B08QF4BLPBME ATP Electronics, Inc.	MODULE DDR4 SDRAM 8GB 2133MT/S	0
MT18KSF1G72AZ-1G6P1 Micron Technology	MODULE DDR3L SDRAM 8GB 240UDIMM	0
AQ12P72D8BLH9M ATP Electronics, Inc.	MEMORY MODULE 4GB 240PIN UNBUFF	0
AL24P72B8BLK0M ATP Electronics, Inc.	MEMORY MODULE 8GB 240PIN ECC	0
AQ12P72D8BLF8M ATP Electronics, Inc.	MEMORY MODULE 4GB 240PIN UNBUFF	0
78.C2GCQ.4000C Apacer	8GB DDR3 1600 ECC SO-DIMM 512X8	5
AL12M72L8BKF8S ATP Electronics, Inc.	MEMORY MODULE 4GB 240PIN ECC	0
AL24M72L8BLH9M ATP Electronics, Inc.	MEMORY MODULE 8GB 240PIN ECC	0
AW12P7218BLF8S ATP Electronics, Inc.	MEMORY MODULE 4GB 240UDIMM	0
AL48P72E4BLF8M ATP Electronics, Inc.	MEMORY MODULE 16GB 240PIN ECC	0
AQ48M64B8BNK0M ATP Electronics, Inc.	MODULE DDR3L SDRAM 16GB 1600MT/S	0
AW12P7218BLH9M ATP Electronics, Inc.	MEMORY MODULE 4GB 240UDIMM	0
SQR-SD3N8G1K6SEEEB Advantech	MODULE DDR3 SDRAM 8GB 204SODIMM	0
AL24P72L8BLH9S ATP Electronics, Inc.	MEMORY MODULE 8GB 240PIN ECC	0
MTA18ASF2G72PZ-3G2E2 Micron Technology	DDR4 16GB RDIMM	0
AT32L64A6SHC4M ATP Electronics, Inc.	MODULE DDR SDRAM 256MB 200SODIMM	0
AY24M7278MNH9M ATP Electronics, Inc.	MEMORY MODULE 8GB 204MINIUDIMM	0
SFUI4096J1AE1TO-C-GS-2AP-STD Swissbit	MODULE FLASH NAND PSLC 4GB	0

Memory - Modules

1. Overview

Memory cards and modules are critical components for data storage and system operation in modern electronic devices. Memory cards are removable solid-state storage devices, while memory modules (e.g., DIMM, SO-DIMM) provide volatile/non-volatile memory for computing systems. Their importance spans consumer electronics, industrial automation, automotive systems, and enterprise infrastructure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
SD/microSD Cards	Portable flash memory with varying speed classes (UHS-I/II, V30/V60)	Smartphones, drones, action cameras
CFexpress Cards	High-speed PCIe/NVMe interface, superior durability	Professional DSLR cameras, video production
DRAM Modules	Volatile memory with fast access rates (DDR4/DDR5 SDRAM)	Computers, servers, gaming consoles
NAND Flash Modules	Non-volatile storage with MLC/TLC configurations	SSDs, industrial controllers
MRAM Modules	Non-volatile, low-power magnetic storage technology	Aerospace, IoT edge devices

3. Structure and Composition

Memory cards typically consist of a plastic/g , gold-plated contact pads, NAND flash chips, and a controller IC for wear leveling. Memory modules use PCB boards with memory chips (DRAM/NAND), heat spreaders, and serialized presence detect (SPD) EEPROM. High-end modules integrate ECC (Error-Correcting Code) circuitry and thermal sensors.

4. Key Technical Specifications

Parameter	Description	Importance
Storage Capacity	1GB-1TB for cards, 1GB-256GB per module	Determines data volume handling capability
Read/Write Speed	10-1000+ MB/s sequential, 10k-1M IOPS random	Affects system responsiveness
Endurance	1000-100,000 P/E cycles	Dictates product lifespan
Operating Temperature	-25 C to +85 C industrial grade	Ensures reliability in harsh environments
Interface Protocol	SD UHS-II, NVMe 1.4, DDR5	Defines compatibility and bandwidth

5. Application Areas

Consumer Electronics: Smartphones (UFS cards), gaming consoles (custom SSD modules)
Industrial Automation: PLC controllers (industrial CFast cards), data loggers
Automotive: ADAS systems (AEC-Q100 qualified NAND), infotainment units
Healthcare: Medical imaging equipment (high-reliability SD cards)
Enterprise: Data center SSDs (3D XPoint memory modules)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Samsung	980 Pro NVMe SSD	7000 MB/s read, PCIe 4.0, TBW: 1200
Kingston	FURY DDR5 RGB DIMM	4800-6000 MT/s, XMP 3.0 support
SanDisk	Extreme Pro CFexpress 2.0	1700 MB/s, 10,000 write cycles
SK hynix	CRONI-DX DDR4	32GB RDIMM, 2666MHz, ECC
Western Digital	WD_BLACK SN850X	Gen4 controller, 7300 MB/s, HMB feature

7. Selection Recommendations

Key considerations include:
- Match interface standards (e.g., DDR5-6400 for latest motherboards)
- Verify environmental requirements (industrial grade for -40 C applications)
- Balance speed vs. endurance (SLC NAND for write-intensive tasks)
- Consider form factor constraints (M.2 2280 vs. U.2 for SSDs)
Case Study: For UAV video recording, select 256GB microSDXC with V60 speed class and 3D NAND to ensure 4K video capture stability.

8. Industry Trends

Emerging developments:
- Transition to 3D NAND stacking (128+ layers)
- Universal Flash Storage (UFS) 4.0 adoption in mobile devices
- CXL (Compute Express Link) interface for high-bandwidth memory expansion
- AI-optimized memory modules with processing-in-memory (PIM) architecture
- Green manufacturing: Lead-free packaging and reduced power consumption (LPDDR5X)