Bobbins (Coil Formers), Mounts, Hardware

Part Number	Description / PDF	Quantity
CON-P11/7 FERROXCUBE	CONTAINER	41
CLM/P-PQ20/16 FERROXCUBE	U SHAPED CLIP	1235
CLI-RM7/ILP FERROXCUBE	CLIP	1924
B64292B1004X000 TDK EPCOS	HOUSING VERTICAL TOROIDS	235
CPV-P18/11-3S-6PD-Z FERROXCUBE	COIL FORMER VERTICAL	0
CP-E65/32/27-1S FERROXCUBE	COIL FORMER	276
CPV-RM12/I-1S-12PD-TZ FERROXCUBE	COIL FORMER VERTICAL	1427
B66306C1010T002 TDK EPCOS	BOBBIN COIL FORMER E 13 X 7 X 4	306
9677142009 Fair-Rite Products Corp.	77 BOBBIN 3PC. ASSEMBLY	1418
CPV-PQ32/30-1S-12P-Z FERROXCUBE	COIL FORMER VERTICAL	1168
CPH-U15/11/6-1S-4P FERROXCUBE	COIL FORMER HORIZONTAL	0
CP-E16/8/5-1S FERROXCUBE	COIL FORMER	0
9677142008 Fair-Rite Products Corp.	77 BOBBIN 3PC. ASSEMBLY COATED	454
CP-E42/21/20-1S FERROXCUBE	COIL FORMER	1007
B64291B1008X000 TDK EPCOS	HOUSING HORIZONTAL TOROIDS	1261
B65615B0001X000 TDK EPCOS	YOKE P 36 X 22	0
B65659F0001X023 TDK EPCOS	ADJUSTMENT SCREW RM 6	1761
CPV-P22/13-3S-6PD-Z FERROXCUBE	COIL FORMER VERTICAL	14
B65518C3000X001 TDK EPCOS	ADJUSTMENT SCREW P 9 X 5	2035
CSH-E25/13/7-1S-7P-C FERROXCUBE	COIL FORMER HORIZONTAL	0

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.