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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
MKS22FN256VLL12557

MKS22FN256VLL12557

NXP Semiconductors

KINETIS S 32-BIT MCU, ARM CORTEX

0
BGU7045115

BGU7045115

NXP Semiconductors

IC AMP LNA 1GHZ W/BYPASS 6TSSOP

6000
TDA18273HN/C1/S3518

TDA18273HN/C1/S3518

NXP Semiconductors

TDA18273 - IC SILICON TUNER HYBR

8000
BUK762R0-40E118

BUK762R0-40E118

NXP Semiconductors

NOW NEXPERIA BUK762R0-40E 120A,

0
PTN3356R1BS528

PTN3356R1BS528

NXP Semiconductors

ROM-BASED LOW-POWER DISPLAYPORT

0
PDTA143ZMB315

PDTA143ZMB315

NXP Semiconductors

NOW NEXPERIA PDTA143ZMB - SMALL

179950
SPC5634MF2MLQ60557

SPC5634MF2MLQ60557

NXP Semiconductors

NXP 32-BIT MCU, POWER ARCHITECTU

60
MWCT1011BVLH557

MWCT1011BVLH557

NXP Semiconductors

WIRELESS CHARGING IC

99900
74LV165DB118

74LV165DB118

NXP Semiconductors

NOW NEXPERIA 74LV165DB - PARALLE

926
BZX84J-B33115

BZX84J-B33115

NXP Semiconductors

NOW NEXPERIA BZX84J-B30 - ZENER

0
PCA9665PW

PCA9665PW

NXP Semiconductors

I2C BUS CONTROLLER

0
S9S12HA32J0VLL557

S9S12HA32J0VLL557

NXP Semiconductors

MICROCONTROLLE, 16-BIT, HCS12 CP

450
NX3008NBKMB315

NX3008NBKMB315

NXP Semiconductors

NOW NEXPERIA NX3008NBKMB SMALL S

2908355
PBSM5240PFH115

PBSM5240PFH115

NXP Semiconductors

NOW NEXPERIA PBSM5240PFH SMALL S

66000
MC33797BPEWR2518

MC33797BPEWR2518

NXP Semiconductors

FOUR CHANNEL SQUIB DRIVER IC

0
PZU11B3A115

PZU11B3A115

NXP Semiconductors

NOW NEXPERIA PZU11B3A ZENER DIOD

30000
PTVS7V5U1UPA,147

PTVS7V5U1UPA,147

NXP Semiconductors

PTVS7V5U1 - 300W TRANSIENT VOLTA

177000
BCW30235

BCW30235

NXP Semiconductors

NOW NEXPERIA BCW30 - SMALL SIGNA

9628
MC15XS3400DHFK557

MC15XS3400DHFK557

NXP Semiconductors

BUFFER/INVERTER BASED PERIPHERAL

6480
MK20DN512VLQ10557

MK20DN512VLQ10557

NXP Semiconductors

KINETIS K10: CORTEX M4 RISC MICR

900

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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