Specialized ICs

Image Part Number Description / PDF Quantity Rfq
80KSBR201BRI

80KSBR201BRI

Renesas Electronics America

IC SERIAL BUFFER 484FCBGA

0

IDT72P51749L6BB

IDT72P51749L6BB

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

80HCPS1616CBLGI8

80HCPS1616CBLGI8

Renesas Electronics America

IC SER RAPIDIO SWITCH 400FCBGA

0

IDT72P51769L6BBI8

IDT72P51769L6BBI8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

TSI572-10GIL

TSI572-10GIL

Renesas Electronics America

IC SER RAPIDIO SWITCH 399TEPBGA

0

80KSW0003AR

80KSW0003AR

Renesas Electronics America

IC SER RAPIDIO SWITCH 324FCBGA

0

IDT72P51369L5BB

IDT72P51369L5BB

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

80HVPS1616RMI8

80HVPS1616RMI8

Renesas Electronics America

IC SWITCH RIO

0

P95020ZNQG

P95020ZNQG

Renesas Electronics America

IC LED/PWR CONTROLLER 132QFN

0

IDT72P51359L6BBI

IDT72P51359L6BBI

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

IDT72P51349L5BB8

IDT72P51349L5BB8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

IDT72P51339L5BB

IDT72P51339L5BB

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

80HVPS1616CBRI-L

80HVPS1616CBRI-L

Renesas Electronics America

IC SWITCH RIO

0

IDT76T1200BH

IDT76T1200BH

Renesas Electronics America

IC INSPECTION ENG PAX 481PBGA

0

IDT72P51559L5BB

IDT72P51559L5BB

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

IDT72P51777L7-5BBI

IDT72P51777L7-5BBI

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 376PBGA

0

IDT72P51749L5BB8

IDT72P51749L5BB8

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

80KSW0004ARI

80KSW0004ARI

Renesas Electronics America

IC SER RAPIDIO SWITCH 324FCBGA

0

P95020ZDNQG

P95020ZDNQG

Renesas Electronics America

IC LED/PWR CONTROLLER 132QFN

0

IDT72P51359L5BB

IDT72P51359L5BB

Renesas Electronics America

IC MULTI-QUEUE FLOW-CTRL 256BGA

0

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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