Specialized ICs

Part Number	Description / PDF	Quantity
P87C52SFAA Rochester Electronics	P87C52 - 80C51, MCS 51, 8-BIT M	0
CP7520AT	CAPSENSE	91
PZU16B2A115 NXP Semiconductors	SINGLE ZENER DIODE	0
1PS66SB82115 NXP Semiconductors	NOW NEXPERIA 1PS66SB82 - MIXER D	122323
IPA50R299CPXKSA1079 IR (Infineon Technologies)	IPA50R299 - 500V COOLMOS N-CHANN	13500
RFP40N10_F102	40A, 100V, 0.04OHM, N-CHANNEL PO	0
SN74LS161ANS Texas Instruments	IC SYNC 4-BIT BIN CNTR 16SO	2000
PZU2.7B1A115 NXP Semiconductors	NOW NEXPERIA PZU2.7B1A - ZENER D	8950
CAP018DG-TL Power Integrations	IC CAPACITOR DISCHARGE 8SO	0
74CBTLV3126BQ115 Nexperia	NOW NEXPERIA 74CBTLV3126BQ - BUS	6000
BAP50-04215 NXP Semiconductors	PIN DIODE 50V	9000
IPA60R190C6 IR (Infineon Technologies)	POWER FIELD-EFFECT TRANSISTOR, 2	0
PSMN017-30BL118 NXP Semiconductors	NOW NEXPERIA PSMN017-30BL 32A, 3	4000
SN74AS32DB Texas Instruments	GATE OR 4CH 2-INP 14-SSOP	21520
MAX6504UKN045+ Analog Devices, Inc.	MAX6504 +2.7V TO +5.5V, MICROPOW	150
ATECC108A-RBHCZ-T Roving Networks / Microchip Technology	IC AUTHENTICATION CHIP 3SMD	4965
MAX4843ELT-T Analog Devices, Inc.	OVERVOLTAGE-PROTECTION IC	7500
SN74AHCU04TPWRSY Texas Instruments	74AHCU04 - HEX INVERTERS 14-PDIP	2000
LM4132CMF3.3 Texas Instruments	SOT-23 PRECISION LOW DROPOUT VOL	105
SN74LS374DB Texas Instruments	D-TYPE POS TRG SNGL 20SSOP	3850

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ASIC (Application-Specific IC)	Custom-designed for a specific application with fixed functionality	Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array)	Reconfigurable logic blocks and interconnects for dynamic functionality	5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip)	Integrates CPU, GPU, memory, and peripherals on a single chip	Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product)	Standardized ICs for specific applications (not fully customized)	Networking switches, display drivers, power management
PLD (Programmable Logic Device)	Basic programmable ICs for simple logic operations	Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
Transistor Array: Millions to billions of MOSFETs or FinFETs
Metal Layers: Multi-layer interconnects for signal routing
IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter	Description	Importance
Power Consumption	Measured in watts (W) or milliwatts (mW)	Determines battery life and thermal management
Operating Frequency	Maximum speed (GHz) for signal processing	Impacts system performance and latency
Process Node	Manufacturing technology (e.g., 7nm, 5nm)	Defines transistor density and energy efficiency
Die Size	Physical chip dimensions (mm )	Affects cost and integration level
Thermal Resistance	Ability to dissipate heat ( C/W)	Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

Telecommunications: 5G modems, optical transceivers
Automotive: ADAS sensors, battery management systems
Healthcare: MRI scanners, portable diagnostic devices
AI/ML: Neural network accelerators, vision processing units
Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Application
Intel	Stratix 10 FPGA	High-performance computing (HPC)
Xilinx	Zynq UltraScale+ MPSoC	Autonomous driving and AI
Texas Instruments	AFE5805 (Analog Front-End)	Medical imaging
Qualcomm	SM8350 SoC	5G smartphones
STMicroelectronics	STM32MP1 (MPU)	Industrial IoT

7. Selection Guidelines

Key considerations:

Performance Requirements: Match clock speed and throughput to application needs
Power Efficiency: Prioritize low-power designs for battery-operated devices
Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
Cost: Balance NRE costs vs. volume production economics
Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
Security Integration: Hardware-based encryption and tamper-proof designs
Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs