PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5939GESA

MAX5939GESA

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

0

MAX5954LETX+

MAX5954LETX+

Maxim Integrated

IC HOT PLUG CTRLR PCI EXP 36TQFN

1182

MAX5936AAESA+

MAX5936AAESA+

Maxim Integrated

IC HOT-SWAP CTRLR -48V 8-SOIC

0

MAX5959LECS+

MAX5959LECS+

Maxim Integrated

IC HOT PLUG CTRLR PCI EXP 80TQFP

0

MAX5970ETX+

MAX5970ETX+

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 36TQFN

0

MAX5960AECS+T

MAX5960AECS+T

Maxim Integrated

IC CTRLR HOT-PLUG QD 80-TQFP

0

MAX5930EEG+

MAX5930EEG+

Maxim Integrated

IC HOT SWAP CTRLR GP 24QSOP

5394

MAX5909UEE+TG11

MAX5909UEE+TG11

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 16QSOP

0

MAX15068ATP+TG2Z

MAX15068ATP+TG2Z

Maxim Integrated

IC HOT SWAP CTRLR GP 20TQFN

0

MAX5936LCESA+T

MAX5936LCESA+T

Maxim Integrated

IC HOT-SWAP CTRLR -48V 8-SOIC

0

MAX5937AAESA+T

MAX5937AAESA+T

Maxim Integrated

IC HOT-SWAP CTRLR -48V 8-SOIC

0

MAX5958LETN+T

MAX5958LETN+T

Maxim Integrated

IC TRPL PCI EXP/HOT-PLUG 56-TQFN

0

MAX5958LETN+

MAX5958LETN+

Maxim Integrated

IC CTRLR HOT-PLUG TRPL 56-TQFN

0

MAX5936ANESA+

MAX5936ANESA+

Maxim Integrated

IC HOT-SWAP CTRLR -48V 8-SOIC

0

MAX5955BEEE+TG002

MAX5955BEEE+TG002

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

MAX5918LEEE+T

MAX5918LEEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

MAX5948AESA+

MAX5948AESA+

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

0

MAX5903LCEUT+G071

MAX5903LCEUT+G071

Maxim Integrated

IC HOT SWAP CTRLR GP SOT23-6

0

MAX5939BESA+T

MAX5939BESA+T

Maxim Integrated

IC HOT-SWAP CTRLR -48V 8-SOIC

0

MAX5948BESA+T

MAX5948BESA+T

Maxim Integrated

IC CNTRLR HOT SWAP 8-SOIC

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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