Logic - Translators, Level Shifters

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74LVX3245WMX

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MC14504BDT

MC14504BDT

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IC TRNSLTR UNIDIR 16TSSOP

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MC10H680FNR2

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IC TRNSLTR BIDIRECTIONAL 28PLCC

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MC100H604FNR2G

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MC100EPT24DTR2G

MC100EPT24DTR2G

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IC TRNSLTR UNIDIRECTIONAL 8TSSOP

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MC100H602FN

MC100H602FN

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IC TRNSLTR UNIDIRECTIONAL 28PLCC

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FXM2IC102L8X_F113

FXM2IC102L8X_F113

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IC TRNSLTR BIDIR 8MICROPAK

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MC100H601FNR2

MC100H601FNR2

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MC100H607FNR2

MC100H607FNR2

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MC100ELT24DTG

MC100ELT24DTG

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MC100ELT24DTR2

MC100ELT24DTR2

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NCN4555MN

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MC100EP90DTR2

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MC100H603FNR2G

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IC TRNSLTR UNIDIRECTIONAL 28PLCC

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100324QIX

100324QIX

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IC TRNSLTR UNIDIRECTIONAL 28PLCC

0

NCN6010DTBR2

NCN6010DTBR2

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IC TRNSLTR BIDIRECTIONAL 14TSSOP

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MC10ELT24DTR2G

MC10ELT24DTR2G

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IC TRNSLTR UNIDIRECTIONAL 8TSSOP

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MC10ELT24DG

MC10ELT24DG

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IC TRNSLTR UNIDIRECTIONAL 8SOIC

0

MC100H600FNG

MC100H600FNG

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IC TRNSLTR UNIDIRECTIONAL 28PLCC

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MC74LVXC3245DTR2

MC74LVXC3245DTR2

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Logic - Translators, Level Shifters

1. Overview

Logic translators and level shifters are semiconductor devices that enable signal compatibility between circuits operating at different voltage levels. These ICs ensure reliable data transmission by converting logic signals from one voltage domain to another, maintaining signal integrity in mixed-voltage systems. Their importance has grown with the proliferation of low-voltage CMOS technologies and multi-rail power architectures in modern electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Single-direction translatorsUnidirectional voltage conversion with isolationSPI interface between 3.3V FPGA and 1.8V sensors
Bi-directional translatorsAutomatic direction detection, dual-voltage I/OI2C bus bridging between 5V microcontroller and 2.5V EEPROM
Multi-channel level shiftersParallel conversion of multiple signals (4-32 channels)Memory interface between SoC and DDR4 SDRAM modules
Direction-controlled translatorsExternal control pin for signal direction selectionUART level conversion in industrial communication modules

3. Structure and Composition

Typical devices feature a monolithic CMOS structure with dual power supply inputs (VCCA and VCCB). Physical components include:

  • Dual-supply MOSFET pairs for voltage translation
  • Integrated clamp circuits for ESD protection
  • Direction control logic (for bidirectional types)
  • Channel-specific enable/disable circuitry

Common package types: TSSOP (14-48 pins), QFN (20-64 pins), WLCSP (1.5 1.5mm ultra-compact).

4. Key Technical Specifications

ParameterSignificance
Voltage range (1.2V-5.5V)Determines compatibility with different logic families
Conversion rate (100Mbps-1.2Gbps)Limits maximum operating frequency
Channel count (1-32)Impacts system integration density
Propagation delay (2-20ns)Affects timing critical applications
Quiescent current (1-100 A)Power efficiency in battery-powered systems

5. Application Areas

Key industries include:

  • Telecommunications: 5G baseband processors interfacing with RF front-ends
  • Industrial automation: PLC modules connecting 24V sensors to 3.3V MCUs
  • Consumer electronics: Smartphone PMIC to application processor communication
  • Automotive systems: CAN-FD transceiver voltage adaptation
  • IoT devices: Sensor hub interfacing between different voltage rail components

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TI (Texas Instruments)TXB01088-channel, 1.2-3.6V to 1.65-5.5V translation, auto-direction detection
NXP SemiconductorsLTC28503.3/5V dual supply, 15kV ESD protection, RS485/UART interface
ON SemiconductorNXU4084-channel, 0.9-5.5V range, sub-1ns propagation delay
STMicroelectronicsL6470Stepper motor driver with integrated level shifting for industrial automation

7. Selection Guidelines

Key considerations:

  • Match supply voltage ranges with source/target systems
  • Ensure conversion rate meets timing requirements
  • Choose appropriate channel density to minimize PCB area
  • For bidirectional buses, select devices with automatic direction sensing
  • Consider thermal performance for high-current applications
  • Evaluate ESD protection levels for industrial environments

8. Industry Trends

Development directions include:

  • Voltage scaling down to 0.8V core operation
  • Integration with signal conditioning functions
  • Increased adoption of capacitive isolation technology
  • Advanced packaging (3D TSV, fan-out WLP)
  • Protocol-aware smart translation (I3C, PCIe 6.0)
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