Logic - Translators, Level Shifters

Part Number	Description / PDF	Quantity
TXB0108RGYR Texas Instruments	IC TRNSLTR BIDIRECTIONAL 20VQFN	0
SN74AVCBH164245KR Texas Instruments	BUS TRANSCEIVER	28885
NTB0102GF,115 NXP Semiconductors	IC TRNSLTR BIDIRECTIONAL 8XSON	3808
NTSX2102GU8H NXP Semiconductors	IC TRNSLTR BIDIRECTIONAL 8XQFN	5716
SN74LVC4245ADWG4 Texas Instruments	IC TRNSLTR BIDIRECTIONAL 24SOIC	0
TXS0101DBVT Texas Instruments	IC TRNSLTR BIDIRECTIONAL SOT23-6	641
NLSV8T240MUTAG	BUS TRANSCEIVER, 8T SERIES, 1-FU	24243
SN74LVCC4245APW Texas Instruments	IC TRNSLTR BIDIRECTIONAL 24TSSOP	299
MC100EPT622MNG	LVTTL/LVCMOS TO LVECL TRANSLATOR	17825
MC100ELT23DTR2G	PECL TO TTL TRANSLATOR, 2 FUNC,	52310
MC10H352PG	TTL/CMOS TO PECL TRANSLATOR	5013
SN74LVC2T45DCURG4 Texas Instruments	IC TRNSLTR BIDIRECTIONAL US8	174
MC10H600FN	TTL TO ECL TRANSLATOR	1172
SN74LVCC4245ADWR Texas Instruments	IC TRNSLTR BIDIRECTIONAL 24SOIC	1826
MC100EPT622MNR4G	LVTTL/LVCMOS TO LVECL TRANSLATOR	11754
MC10H600FNR2G	TTL TO ECL TRANSLATOR	1154
MC10H601FNG	ECL TO TTL TRANSLATOR, 9 FUNC, T	454
MC10ELT20DTG	TTL/CMOS TO PECL TRANSLATOR	2430
LSF0102DC-Q100H Nexperia	LSF0102DC-Q100/SOT765/VSSOP8	0
74AUP1T97L6X	TWO-INPUT, LOW POWER, CONFIGURAB	142800

Logic - Translators, Level Shifters

1. Overview

Logic translators and level shifters are semiconductor devices that enable signal compatibility between circuits operating at different voltage levels. These ICs ensure reliable data transmission by converting logic signals from one voltage domain to another, maintaining signal integrity in mixed-voltage systems. Their importance has grown with the proliferation of low-voltage CMOS technologies and multi-rail power architectures in modern electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-direction translators	Unidirectional voltage conversion with isolation	SPI interface between 3.3V FPGA and 1.8V sensors
Bi-directional translators	Automatic direction detection, dual-voltage I/O	I2C bus bridging between 5V microcontroller and 2.5V EEPROM
Multi-channel level shifters	Parallel conversion of multiple signals (4-32 channels)	Memory interface between SoC and DDR4 SDRAM modules
Direction-controlled translators	External control pin for signal direction selection	UART level conversion in industrial communication modules

3. Structure and Composition

Typical devices feature a monolithic CMOS structure with dual power supply inputs (VCCA and VCCB). Physical components include:

Dual-supply MOSFET pairs for voltage translation
Integrated clamp circuits for ESD protection
Direction control logic (for bidirectional types)
Channel-specific enable/disable circuitry

Common package types: TSSOP (14-48 pins), QFN (20-64 pins), WLCSP (1.5 1.5mm ultra-compact).

4. Key Technical Specifications

Parameter	Significance
Voltage range (1.2V-5.5V)	Determines compatibility with different logic families
Conversion rate (100Mbps-1.2Gbps)	Limits maximum operating frequency
Channel count (1-32)	Impacts system integration density
Propagation delay (2-20ns)	Affects timing critical applications
Quiescent current (1-100 A)	Power efficiency in battery-powered systems

5. Application Areas

Key industries include:

Telecommunications: 5G baseband processors interfacing with RF front-ends
Industrial automation: PLC modules connecting 24V sensors to 3.3V MCUs
Consumer electronics: Smartphone PMIC to application processor communication
Automotive systems: CAN-FD transceiver voltage adaptation
IoT devices: Sensor hub interfacing between different voltage rail components

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	TXB0108	8-channel, 1.2-3.6V to 1.65-5.5V translation, auto-direction detection
NXP Semiconductors	LTC2850	3.3/5V dual supply, 15kV ESD protection, RS485/UART interface
ON Semiconductor	NXU408	4-channel, 0.9-5.5V range, sub-1ns propagation delay
STMicroelectronics	L6470	Stepper motor driver with integrated level shifting for industrial automation

7. Selection Guidelines

Key considerations:

Match supply voltage ranges with source/target systems
Ensure conversion rate meets timing requirements
Choose appropriate channel density to minimize PCB area
For bidirectional buses, select devices with automatic direction sensing
Consider thermal performance for high-current applications
Evaluate ESD protection levels for industrial environments

8. Industry Trends

Development directions include:

Voltage scaling down to 0.8V core operation
Integration with signal conditioning functions
Increased adoption of capacitive isolation technology
Advanced packaging (3D TSV, fan-out WLP)
Protocol-aware smart translation (I3C, PCIe 6.0)