Logic - Translators, Level Shifters

Part Number	Description / PDF	Quantity
MC10H424FN	TTL TO ECL TRANSLATOR	3404
MAX13014EKA+T Maxim Integrated	IC TRNSLTR BIDIRECTIONAL SOT23-8	50000
PI4GTL2014LEX Zetex Semiconductors (Diodes Inc.)	IC TRNSLTR UNIDIR 14TSSOP	3470
MC100ELT23DR2G Sanyo Semiconductor/ON Semiconductor	IC TRNSLTR UNIDIRECTIONAL 8SOIC	170
NLVSV1T244MUTBG	BUS DRIVER, 1T SERIES, 1-FUNC, 1	32858
MC10H350P	PECL TO TTL TRANSLATOR	5489
SN74AVCAH164245KR Texas Instruments	BUS TRANSCEIVER	83334
TXS0104ERGYRG4 Texas Instruments	IC TRNSLTR BIDIRECTIONAL 14VQFN	0
SN65ELT22DR Texas Instruments	SN65ELT22 5V DUAL TTL TO DIFFERE	65000
SN65LVELT23DGK Texas Instruments	IC TRNSLTR UNIDIRECTIONAL 8VSSOP	491
MAX3395EETC+T Maxim Integrated	IC TRNSLTR BIDIRECTIONAL 12TQFN	145
NLSV2T240MUTAG	BUS DRIVER, 2T SERIES, 1-FUNC, 2	105475
ADG3304WBRUZ-REEL Analog Devices, Inc.	INTERFACE CIRCUIT, CMOS, PDSO14	10624
74AVCH2T45GD,125-NX NXP Semiconductors	BUS TRANSCEIVER, AVC SERIES, 2 F	0
HEF4104BP,652 NXP Semiconductors	BUS DRIVER	2227
ADG3304BCPZ-REEL Analog Devices, Inc.	IC TRNSLTR BIDIRECTIONAL 20LFCSP	0
LTC1556IGN#PBF Analog Devices, Inc.	IC TRNSLTR BIDIRECTIONAL 20SSOP	0
NLSV1T240MUTBG	BUS DRIVER, 1T SERIES, 1-FUNC, 1	150661
NB100ELT23LD	PECL TO TTL TRANSLATOR	42963
SN74GTLP817DW Texas Instruments	BUS DRIVER	13450

Logic - Translators, Level Shifters

1. Overview

Logic translators and level shifters are semiconductor devices that enable signal compatibility between circuits operating at different voltage levels. These ICs ensure reliable data transmission by converting logic signals from one voltage domain to another, maintaining signal integrity in mixed-voltage systems. Their importance has grown with the proliferation of low-voltage CMOS technologies and multi-rail power architectures in modern electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Single-direction translators	Unidirectional voltage conversion with isolation	SPI interface between 3.3V FPGA and 1.8V sensors
Bi-directional translators	Automatic direction detection, dual-voltage I/O	I2C bus bridging between 5V microcontroller and 2.5V EEPROM
Multi-channel level shifters	Parallel conversion of multiple signals (4-32 channels)	Memory interface between SoC and DDR4 SDRAM modules
Direction-controlled translators	External control pin for signal direction selection	UART level conversion in industrial communication modules

3. Structure and Composition

Typical devices feature a monolithic CMOS structure with dual power supply inputs (VCCA and VCCB). Physical components include:

Dual-supply MOSFET pairs for voltage translation
Integrated clamp circuits for ESD protection
Direction control logic (for bidirectional types)
Channel-specific enable/disable circuitry

Common package types: TSSOP (14-48 pins), QFN (20-64 pins), WLCSP (1.5 1.5mm ultra-compact).

4. Key Technical Specifications

Parameter	Significance
Voltage range (1.2V-5.5V)	Determines compatibility with different logic families
Conversion rate (100Mbps-1.2Gbps)	Limits maximum operating frequency
Channel count (1-32)	Impacts system integration density
Propagation delay (2-20ns)	Affects timing critical applications
Quiescent current (1-100 A)	Power efficiency in battery-powered systems

5. Application Areas

Key industries include:

Telecommunications: 5G baseband processors interfacing with RF front-ends
Industrial automation: PLC modules connecting 24V sensors to 3.3V MCUs
Consumer electronics: Smartphone PMIC to application processor communication
Automotive systems: CAN-FD transceiver voltage adaptation
IoT devices: Sensor hub interfacing between different voltage rail components

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
TI (Texas Instruments)	TXB0108	8-channel, 1.2-3.6V to 1.65-5.5V translation, auto-direction detection
NXP Semiconductors	LTC2850	3.3/5V dual supply, 15kV ESD protection, RS485/UART interface
ON Semiconductor	NXU408	4-channel, 0.9-5.5V range, sub-1ns propagation delay
STMicroelectronics	L6470	Stepper motor driver with integrated level shifting for industrial automation

7. Selection Guidelines

Key considerations:

Match supply voltage ranges with source/target systems
Ensure conversion rate meets timing requirements
Choose appropriate channel density to minimize PCB area
For bidirectional buses, select devices with automatic direction sensing
Consider thermal performance for high-current applications
Evaluate ESD protection levels for industrial environments

8. Industry Trends

Development directions include:

Voltage scaling down to 0.8V core operation
Integration with signal conditioning functions
Increased adoption of capacitive isolation technology
Advanced packaging (3D TSV, fan-out WLP)
Protocol-aware smart translation (I3C, PCIe 6.0)