Logic - Signal Switches, Multiplexers, Decoders

Image Part Number Description / PDF Quantity Rfq
74AUP1G19GM,115

74AUP1G19GM,115

Nexperia

IC DECODER/DEMUX 1 X 1:2 6XSON

4030

74CB3Q3257PWJ

74CB3Q3257PWJ

Nexperia

IC MUX/DEMUX 4 X 2:1 16TSSOP

1986

74HC237D-Q100J

74HC237D-Q100J

Nexperia

IC DECODER/DEMUX 1 X 3:8 16SO

0

74LVC257ADB,112

74LVC257ADB,112

Nexperia

IC MULTIPLEXER 4 X 2:1 16SSOP

0

CBT3125PW,118

CBT3125PW,118

Nexperia

IC BUS SWITCH 1 X 1:1 14TSSOP

444

74HC251PW,118

74HC251PW,118

Nexperia

IC MULTIPLEXER 1 X 8:1 16TSSOP

410

74HC4515D,652

74HC4515D,652

Nexperia

IC DECODER/DEMUX 1X4:16 24SO

201

74AHC157PW-Q100J

74AHC157PW-Q100J

Nexperia

IC MULTIPLEXER 4 X 2:1 16TSSOP

0

74AUP1G18GM,115

74AUP1G18GM,115

Nexperia

IC DEMUX 1X1:2 6XSON/SOT886

0

CBT3384PW,112

CBT3384PW,112

Nexperia

IC BUS SWITCH 5 X 1:1 24TSSOP

3150

74HC257D,653

74HC257D,653

Nexperia

IC MULTIPLEXER 4 X 2:1 16SO

2843

74LVC1G157GW,125

74LVC1G157GW,125

Nexperia

NOW NEXPERIA 74LVC1G157GW - MULT

51617

74HCT238PW,112

74HCT238PW,112

Nexperia

IC DECODER/DEMUX 1X3:8 16TSSOP

1536

74CBTLV3253PW-Q10J

74CBTLV3253PW-Q10J

Nexperia

IC MUX/DEMUX 2 X 4:1 16TSSOP

0

74LVC157AD,112

74LVC157AD,112

Nexperia

IC MULTIPLEXER 4 X 2:1 16SO

628

CBTD3384PW,118

CBTD3384PW,118

Nexperia

IC BUS SWITCH 5 X 1:1 24TSSOP

960

74CB3Q3253BQX

74CB3Q3253BQX

Nexperia

IC MUX/DEMUX 2 X 4:1 16DHVQFN

2950

74CBTLVD3245PW,118

74CBTLVD3245PW,118

Nexperia

IC BUS SWITCH 8 X 1:1 20TSSOP

1979

CBT3384DK,118

CBT3384DK,118

Nexperia

IC BUS SWITCH 5 X 1:1 24SSOP

87100

74LVC257APW,112

74LVC257APW,112

Nexperia

IC MULTIPLEXER 4 X 2:1 16TSSOP

1491

Logic - Signal Switches, Multiplexers, Decoders

1. Overview

Signal switches, multiplexers, and decoders are fundamental logic ICs used to manage signal routing and data selection in electronic systems. Signal switches control the flow of electrical signals, multiplexers select between multiple input signals, and decoders convert encoded signals into specific outputs. These components are critical in modern technologies such as telecommunications, computing, and industrial automation, enabling efficient data handling and system design simplification.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Signal SwitchesDigital/analog switches with on/off controlAudio routing, power management
Multiplexers (MUX)2:1 to 16:1 channel selection, data bus sharingNetwork switches, sensor data aggregation
DecodersBinary-to-decimal, BCD-to-7-segment conversionMemory address decoding, display drivers

3. Structure and Composition

These ICs typically use CMOS or TTL technology with standard packages like DIP, SOP, and QFN. Internal components include transistor arrays, logic gates, and channel control circuits. For example, a 4-channel analog switch integrates four independent switching elements in a single package with common control lines.

4. Key Technical Specifications

ParameterDescriptionImportance
On-resistance (RON)Resistance in conducting stateImpacts signal integrity
BandwidthMaximum signal frequency supportedDetermines high-speed capability
Channel countNumber of independent pathsSystem scalability
Power consumptionQuiescent current and switching lossBattery life consideration
Propagation delaySignal transmission timeCritical for timing-sensitive systems

5. Application Areas

  • Telecommunications: Signal routing in base stations
  • Automotive: Sensor signal selection in ECUs
  • Consumer Electronics: HDMI switch boxes
  • Industrial: PLC signal conditioning
  • Computing: Memory address decoding in CPUs

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TISN74CB3Q324510- RON, 2.3V-3.6V supply
Analog DevicesADG14124-channel switch, 165MHz bandwidth
NXP74HC1518:1 multiplexer, 70MHz operation
STMicroelectronicsCD4028BEBCD-to-decimal decoder, 18V rating

7. Selection Guidelines

  • Channel requirements: Match input/output count needs
  • Signal type: Choose analog/digital switches accordingly
  • Voltage compatibility: Ensure supply voltage matches system rails
  • Speed vs. power trade-off: High bandwidth increases consumption
  • Package constraints: Consider PCB space and thermal requirements

8. Industry Trends

Current developments focus on miniaturization (0.4mm pitch packages), lower on-resistance (<1 ), and integration with level-shifting functions. The rise of IoT and 5G drives demand for high-frequency switches (up to 10GHz) with sub-mW standby power. Advanced CMOS processes enable higher channel density while maintaining signal integrity in automotive-grade temperature ranges.

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