Logic - Flip Flops

Part Number	Description / PDF	Quantity
CD74ACT574EG4 Texas Instruments	IC FF D-TYPE SNGL 8BIT 20DIP	0
54F74LM	D FLIP-FLOP, F/FAST SERIES TTL	0
5962-8752501MCA Texas Instruments	SN54ACT74 DUAL POSITIVE-EDGE-TRI	1534
SN74LVC374ARGYR Texas Instruments	SN74LVC374A OCTAL EDGE-TRIGGERED	1687
MC74HC174ADT	D FLIP-FLOP, HC/UH SERIES, 6-BIT	3280
SN74AUP1G74YZPR Texas Instruments	IC FF D-TYPE SNGL 1BIT 8DSBGA	2397
SN74ABT574N Texas Instruments	D-TYPE FLIP-FLOPS	0
SN74S113N Rochester Electronics	J-K FLIP-FLOP, S SERIES, 2-FUNC,	4586
74ABT74D,112 Nexperia	IC FF D-TYPE DUAL 1BIT 14SO	0
CD74ACT74E Texas Instruments	DUAL D-TYPE FLIP-FLOP	34587
MC74VHCT374ADTR2	BUS DRIVER	12500
CD40174BK3	CMOS HEX D-TYPE FLIP-FLOP	8
SN74LV74ADG4	D FLIP-FLOP	0
MC10EL31DR2	D FLIP-FLOP	8861
SN74HCT374DWG4 Texas Instruments	IC FF D-TYPE SNGL 8BIT 20SOIC	0
DM7474M	D FLIP-FLOP, TTL	1705
74LVT574PW,118 NXP Semiconductors	BUS DRIVER	24259
74ACT374SJ	BUS DRIVER	13388
N74F374D,602 NXP Semiconductors	BUS DRIVER	3894
CD74ACT574E	BUS DRIVER	5361

Logic - Flip Flops

1. Overview

Flip flops are fundamental building blocks in digital electronics, serving as bistable multivibrators capable of storing one bit of data. They form the basis of sequential logic circuits, enabling data storage, synchronization, and state control. Their ability to maintain stable states until triggered by clock signals makes them critical in memory units, counters, and register files. Modern computing, telecommunications, and automation systems rely heavily on flip flops for reliable data management and timing control.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
SR Flip Flop	Set-Reset operation with undefined state when both inputs activate	Basic memory elements, control circuits
D Flip Flop	Data storage with single data input synchronized by clock edge	Registers, shift registers, data buffers
JK Flip Flop	Universal type eliminating invalid states through feedback	Counters, frequency dividers, state machines
T Flip Flop	Toggle state with each clock pulse when input active	Binary counters, clock division circuits

3. Structure and Composition

Flip flops are typically constructed using transistor-transistor logic (TTL) or complementary metal-oxide-semiconductor (CMOS) technologies. A standard CMOS D flip flop contains 8-12 transistors arranged in master-slave configuration with transmission gates. Key components include:

Clock signal input for synchronization
Data input/output terminals
Feedback paths for state retention
Level-sensitive or edge-triggered control circuitry

4. Key Technical Specifications

Parameter	Typical Range	Importance
Clock Frequency	DC to 10GHz (varies by technology)	Determines maximum operating speed
Propagation Delay	1-10ns (CMOS), 3-20ns (TTL)	Impacts circuit timing margins
Power Consumption	1mW-100mW per flip flop	Critical for battery-powered devices
Setup/Hold Time	0.1-2ns	Essential for reliable data capture
Output Drive Strength	2mA-24mA	Affects fan-out capability

5. Application Domains

Telecommunications: Synchronization circuits in 5G base stations, optical transceivers
Computing: CPU register files, cache memory controllers
Industrial Control: Programmable logic controllers (PLCs), sensor interfaces
Consumer Electronics: Timing circuits in smartphones, wearable devices
Automotive: CAN bus controllers, ADAS synchronization modules

6. Leading Manufacturers and Products

Manufacturer	Representative Products	Key Features
Texas Instruments	SN74LVC1G80	Single D flip flop with 14ns delay, 2GHz clock rate
STMicroelectronics	STM74HC74ADG	Dual D flip flop with 8mA drive, 125MHz operation
NXP Semiconductors	74AUP1G175GF	Low-power quad D flip flop, 0.9V-3.6V operation
Intel	IOP333B00ES	High-speed differential flip flops for FPGA interfaces

7. Selection Guidelines

Key selection criteria include:

Speed requirements vs. power budget trade-offs
Compatibility with existing logic families (TTL/CMOS)
Package type (QFP, BGA, WLCSP) for PCB constraints
Environmental specifications (temperature range, radiation hardness)
Integration level (discrete vs. embedded in FPGAs/ASICs)

Example: For high-speed networking equipment, select flip flops with <1ns jitter and LVDS compatibility.

8. Industry Trends

Current development trends include:

Migration to FinFET and GAAFET transistor structures for sub-5nm nodes
Integration with on-die clocking networks in 3D-stacked ICs
Emergence of spin-transfer torque flip flops for non-volatile memory
Adoption of photonics-ready flip flops for optical computing interfaces
Development of ultra-low-voltage ( 0.5V) flip flops for IoT applications