Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
SN74ALVC7805-40DLR

SN74ALVC7805-40DLR

Texas Instruments

256 X 18 CLOCKED FIFO

2000

SN74ALVC3631-20PCB

SN74ALVC3631-20PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36

249

SN74ACT7200L15NP

SN74ACT7200L15NP

Texas Instruments

FIFO MEM ASYNC 256 X 9

4161

SN74V3670-7PEU

SN74V3670-7PEU

Texas Instruments

FIFO, 8KX36, 5NS, SYNCHRONOUS

1950

SN74ALS2233AFNR

SN74ALS2233AFNR

Texas Instruments

FIFO, 64X9, 24NS, SYNCHRONOUS

1500

SN74V293-15PZA

SN74V293-15PZA

Texas Instruments

SN74V293 65536 X 18 SYNCHRONOUS

0

SN74ACT2227DW

SN74ACT2227DW

Texas Instruments

SN74ACT2227 64 X 1 X 2 DUAL INDE

2665

SN74ACT7200L35RJ

SN74ACT7200L35RJ

Texas Instruments

FIFO, 256X9, 35NS, ASYNCHRONOUS

758

SN74ACT7204L50RJ

SN74ACT7204L50RJ

Texas Instruments

FIFO, 4KX9, 50NS, ASYNCHRONOUS

1327

SN54LS224AJ

SN54LS224AJ

Texas Instruments

FIFO, 16X4, 80NS, SYNCHRONOUS

0

SN74ALVC3641-10PQ

SN74ALVC3641-10PQ

Texas Instruments

BI-DIRECTIONAL FIFO, 1KX36

350

SN74V283-6PZA

SN74V283-6PZA

Texas Instruments

SN74V283 32768 X 18 SYNCHRONOUS

0

SN74ALS232BFNR

SN74ALS232BFNR

Texas Instruments

FIFO, 16X4, 30NS, ASYNCHRONOUS

7950

SN74ACT7808-25PAG

SN74ACT7808-25PAG

Texas Instruments

FIFO, 2KX9, 22NS, SYNCHRONOUS

1528

SN74ALS232BDWR

SN74ALS232BDWR

Texas Instruments

FIFO, 16X4, 30NS, ASYNCHRONOUS

1000

SN74ACT72241L50RJ

SN74ACT72241L50RJ

Texas Instruments

FIFO MEM SYNC UNI-DIR 4K X 9

5739

SN74ALVC7813-25DLR

SN74ALVC7813-25DLR

Texas Instruments

FIFO, 64X18, 15NS, SYNCHRONOUS

9000

SN74ACT7806-25DL

SN74ACT7806-25DL

Texas Instruments

FIFO, 256X18, 18NS, SYNCHRONOUS

5366

SN74ACT7206L15RJ

SN74ACT7206L15RJ

Texas Instruments

FIFO, 16KX9, 15NS, ASYNCHRONOUS

3184

SN74ACT7806-40DL

SN74ACT7806-40DL

Texas Instruments

IC STROBED FIFO 256X18 56-SSOP

61

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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