Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
M66282FP#DB0T

M66282FP#DB0T

Renesas Electronics America

M66258FP FIFO, 8KX8

6000

7200L20TDB

7200L20TDB

Renesas Electronics America

IC MEM FIFO 256X9 ASYNC 28CDIP

0

72V3670L6BB8

72V3670L6BB8

Renesas Electronics America

IC FIFO SS 8192X36 6NS 144-BGA

0

72T18115L5BBGI

72T18115L5BBGI

Renesas Electronics America

IC FIFO 262KX18 2.5V 5NS 240BGA

0

72V255LA15TFGI

72V255LA15TFGI

Renesas Electronics America

IC FIFO SS 8192X18 15NS 64-STQFP

0

72V283L6PFG8

72V283L6PFG8

Renesas Electronics America

IC MEM FIFO 32768X18 80QFP

0

72T36105L10BB

72T36105L10BB

Renesas Electronics America

IC FIFO 131X18 10NS 240BGA

0

72825LB15BG8

72825LB15BG8

Renesas Electronics America

IC FIFO SYNC DL 1024X18 121BGA

0

72825LB25BG

72825LB25BG

Renesas Electronics America

IC FIFO SYNC DL 1024X18 121BGA

0

7200L30TDB

7200L30TDB

Renesas Electronics America

IC MEM FIFO 256X9 ASYNC 28CDIP

0

72V265LA15PFGI

72V265LA15PFGI

Renesas Electronics America

IC MEM FIFO 16384X18 64-TQFP

0

7203L20TDB

7203L20TDB

Renesas Electronics America

IC MEM FIFO 2048X9 20NS 28CDIP

0

72T72115L4-4BB

72T72115L4-4BB

Renesas Electronics America

IC FIFO 131072X72 4-4NS 324-BGA

0

5962-8753101TA

5962-8753101TA

Renesas Electronics America

CDIP 37.72X7.62X3.56 MM, 2.54MM

0

72T18125L5BBGI

72T18125L5BBGI

Renesas Electronics America

IC FIFO 524X18 2.5V 5NS 240BGA

0

5962-8956807ZA

5962-8956807ZA

Renesas Electronics America

LCC 11.40X13.97X1.78 MM, 1.27MM

0

72V3611L15PFG8

72V3611L15PFG8

Renesas Electronics America

IC FIFO SYNC 64X36 15NS 120TQFP

0

72V2113L6BC

72V2113L6BC

Renesas Electronics America

IC FIFO SUPERSYNCII 6NS 100-BGA

0

72V283L7-5PFGI

72V283L7-5PFGI

Renesas Electronics America

IC FIFO 32768X18 7-5NS 80QFP

0

72T36125L10BB

72T36125L10BB

Renesas Electronics America

IC FIFO 524X18 10NS 240BGA

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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