Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
67C401-15NL

67C401-15NL

FIFO, 64X4, ASYNCHRONOUS

2083

SN74ALVC7805-25DL

SN74ALVC7805-25DL

Texas Instruments

FIFO, 256X18, 15NS, SYNCHRONOUS

2205

CY7C4201-15JXC

CY7C4201-15JXC

IR (Infineon Technologies)

FIFO, 256X9, 10NS, SYNCHRONOUS

150

QS7204-50SO

QS7204-50SO

FIFO, 4KX9, 50NS, ASYNCHRONOUS

185

SN74ACT7201LA50DV

SN74ACT7201LA50DV

Texas Instruments

FIFO, 512X9, 50NS, ASYNCHRONOUS

0

QS7201-25JR

QS7201-25JR

FIFO, 512X9, 25NS, ASYNCHRONOUS

1103

SN74ACT7807-25PAG

SN74ACT7807-25PAG

Texas Instruments

FIFO, 2KX9, 18NS, SYNCHRONOUS

2402

SN74ABT3614-15PQ

SN74ABT3614-15PQ

Texas Instruments

BI-DIRECTIONAL FIFO, 64X36, 10NS

5852

SN74ACT7200L25NP

SN74ACT7200L25NP

Texas Instruments

FIFO, 256X9, 25NS, ASYNCHRONOUS

2264

72V03L25J

72V03L25J

Renesas Electronics America

IC FIFO ASYNC 2048X9 25NS 32PLCC

19

72825LB10PFG8

72825LB10PFG8

Renesas Electronics America

IC FIFO SYNC DL 1024X18 128TQFP

0

SN74ABT3614-15PCB

SN74ABT3614-15PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 64X36, 10NS

184

SN74ACT72231L20RJR

SN74ACT72231L20RJR

Texas Instruments

FIFO MEM SYNC UNI-DIR 2K X 9

8250

AM7202A-15RC

AM7202A-15RC

FIFO, 1KX9, 15NS, ASYNCHRONOUS

13

CY7C4255V-15ASI

CY7C4255V-15ASI

IR (Infineon Technologies)

FIFO, 8KX18, 10NS, SYNCHRONOUS

17

CY7C421-25PC

CY7C421-25PC

Rochester Electronics

FIFO, 512X9, 25NS, ASYNCHRONOUS

563

SN74ACT7881-20PN

SN74ACT7881-20PN

Texas Instruments

FIFO, 1KX18, 13NS, SYNCHRONOUS

307

72V06L25JGI8

72V06L25JGI8

Renesas Electronics America

IC ASYNCH 8192X18 25NS 32PLCC

0

CY7C421-20VC

CY7C421-20VC

Rochester Electronics

FIFO, 512X9, 20NS, ASYNCHRONOUS

117

72V03L15JG

72V03L15JG

Renesas Electronics America

IC ASYNCH 2048X9 15NS 32-PLCC

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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