Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
72V3672L10PFG

72V3672L10PFG

Renesas Electronics America

IC FIFO 16384X36 10NS 120QFP

0

SN74ACT7202LA25DV

SN74ACT7202LA25DV

Texas Instruments

FIFO, 1KX9, 25NS, ASYNCHRONOUS

38

AM7201-35PC

AM7201-35PC

FIFO, 512X9, 35NS, ASYNCHRONOUS

0

SN74ACT7814-20DLR

SN74ACT7814-20DLR

Texas Instruments

FIFO, 64X18, 15NS, SYNCHRONOUS

3665

CD74HC7030E

CD74HC7030E

64-WORD X 9-BIT FIFO REGISTER

581

CY7C470-25JC

CY7C470-25JC

FIFO, 8KX9, 25NS, ASYNCHRONOUS

0

SN74ACT7807-15FN

SN74ACT7807-15FN

Texas Instruments

FIFO, 2KX9, 12NS, SYNCHRONOUS

2498

CY7C4201-25JC

CY7C4201-25JC

Rochester Electronics

FIFO, 256X9, 15NS, SYNCHRONOUS

13064

CY7C419-20JC

CY7C419-20JC

Rochester Electronics

FIFO, 256X9, 20NS, ASYNCHRONOUS

1966

SN74ALVC7803-25DLR

SN74ALVC7803-25DLR

Texas Instruments

FIFO, 512X18, 15NS, SYNCHRONOUS

1000

SN74ABT7819A-15PN

SN74ABT7819A-15PN

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18

1858

7284L15PAGI

7284L15PAGI

Renesas Electronics America

IC MEM FIFO 2048X18 56TSSOP

0

74HC7403N,112

74HC7403N,112

NXP Semiconductors

FIFO, 64X9, 104NS, ASYNCHRONOUS

2000

7285L15PAGI8

7285L15PAGI8

Renesas Electronics America

IC FIFO 4096X18 15NS 56TSSOP

0

SN74ALVC7803-20DLR

SN74ALVC7803-20DLR

Texas Instruments

FIFO, 512X18, 13NS, SYNCHRONOUS

978

SN74ABT7819A-10PN

SN74ABT7819A-10PN

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18

597

SN74ACT7882-20FN

SN74ACT7882-20FN

Texas Instruments

FIFO, 2KX18, 13NS, SYNCHRONOUS

1367

CY7C433-40JC

CY7C433-40JC

FIFO, 4KX9, 40NS, ASYNCHRONOUS

1928

72811L10PFG8

72811L10PFG8

Renesas Electronics America

IC FIFO SYNC DUAL 512X9 64-TQFP

0

72V36110L6BBG8

72V36110L6BBG8

Renesas Electronics America

IC FIFO SYNC 131KX36 6NS 144BGA

0

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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