Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
7200L15TPGI

7200L15TPGI

Renesas Electronics America

IC MEM FIFO 256X9 15NS 28DIP

0

72V205L10PFG8

72V205L10PFG8

Renesas Electronics America

IC FIFO SYNC 16KX9 10NS 64QFP

0

QS7244A-25JR

QS7244A-25JR

QUALITY SEMI FIFO 4KX9 25NS SYNC

227

CY7C425-25VC

CY7C425-25VC

Rochester Electronics

FIFO, 1KX9, 25NS, ASYNCHRONOUS

40

CD74HC40105M96

CD74HC40105M96

Texas Instruments

CD74HC40105 HIGH SPEED CMOS LOGI

5000

QS7201-25V

QS7201-25V

FIFO, 512X9, 25NS, ASYNCHRONOUS

722

CY7C4255V-25ASC

CY7C4255V-25ASC

Rochester Electronics

FIFO, 8KX18, 15NS, SYNCHRONOUS

345

CY7C4211-15JC

CY7C4211-15JC

Rochester Electronics

FIFO, 512X9, 10NS, SYNCHRONOUS

855

72V2105L15PFGI8

72V2105L15PFGI8

Renesas Electronics America

IC FIFO SUPERSYNCII 15NS 64-TQFP

0

SN74V3680-10PEU

SN74V3680-10PEU

Texas Instruments

FIFO, 16KX36, 6.5NS, SYNCHRONOUS

1152

CY7C4831-10AC

CY7C4831-10AC

IR (Infineon Technologies)

FIFO, 2KX9, 8NS, SYNCHRONOUS

269

CY7C462A-25PTC

CY7C462A-25PTC

Rochester Electronics

FIFO, 16KX9, 25NS, ASYNCHRONOUS

139

72V215L10TFG8

72V215L10TFG8

Renesas Electronics America

IC FIFO SYNC 512X18 10NS 64STQFP

0

CY7C421-10VC

CY7C421-10VC

Rochester Electronics

FIFO, 512X9, 10NS, ASYNCHRONOUS

364

CY7C4261-10JXI

CY7C4261-10JXI

Rochester Electronics

FIFO, 16KX9, 8NS, SYNCHRONOUS

2099

QS7201-20V

QS7201-20V

QUALITY SEMI FIFO 512X ASYNC

336

72V3660L6PFG

72V3660L6PFG

Renesas Electronics America

IC FIFO SYNC II 36BIT 128-TQFP

0

CY7C43684AV-10AC

CY7C43684AV-10AC

Rochester Electronics

BI-DIRECTIONAL FIFO, 16KX36

29

SN74ACT7811-18FNR

SN74ACT7811-18FNR

Texas Instruments

FIFO, 1KX18, 18NS, SYNCHRONOUS

1500

SN74ACT2235-20PAG

SN74ACT2235-20PAG

Texas Instruments

BI-DIRECTIONAL FIFO, 1KX9

2954

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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