Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74HCT244PWR Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	7932
CD74HC652EN Texas Instruments	IC TXRX NON-INVERT 6V 24DIP	2709
SN74AVC16245DGGR Texas Instruments	IC TXRX NON-INVERT 3.6V 48TSSOP	498
CY74FCT2240TS0C Texas Instruments	BUS DRIVER, FCT SERIES, 2 FUNC,	1257
SN74LVTH125PW Texas Instruments	IC BUF NON-INVERT 3.6V 14TSSOP	1073
SN74LV126ADGVR Texas Instruments	IC BUF NON-INVERT 5.5V 14TVSOP	1394
SN74LVC244ADBR Texas Instruments	IC BUF NON-INVERT 3.6V 20SSOP	4194
SN74LVC16245DL Texas Instruments	BUS TRANSCEIVER	0
SN74LVC07AQPWRQ1 Texas Instruments	IC BUF NON-INVERT 5.5V 14TSSOP	42
SN74F543DWR Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	0
SN74HCT245PWRE4 Texas Instruments	IC TXRX NON-INVERT 5.5V 20TSSOP	0
JM38510/34803B2A Texas Instruments	54F245 OCTAL BUS TRANSCEIVERS WI	965
SN74HC125NSRE4 Texas Instruments	IC BUFFER NON-INVERT 6V 14SOP	0
SN74LVC245ADGVR Texas Instruments	IC TXRX NON-INVERT 3.6V 20TVSOP	4916
SN74LVC16244AZRDR Texas Instruments	IC BUFFER NON-INVERT 3.6V 54BGA	37466
SN74AHC245N Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	116
SN74LVT162240DLR Texas Instruments	IC BUFFER INVERT 3.6V 48SSOP	8787
CY74FCT16374CTPAC Texas Instruments	BUS DRIVER, FCT SERIES	5845
CD4010BPWRG4 Texas Instruments	IC BUFFER NON-INVERT 18V 16TSSOP	0
SN74F125N Texas Instruments	IC BUF NON-INVERT 5.5V 14DIP	951

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications