| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Maxim Integrated |
DOCSIS 3.0 UPSTREAM AMPLIFIER |
240 |
|
|
Maxim Integrated |
16 CHANNEL HIGH VOLTAGE PROTECTE |
0 |
|
|
Maxim Integrated |
2.5GBPS, +3V TO +5.5V, WIDE DYNA |
0 |
|
|
Maxim Integrated |
1.25GBPS/2.5GBPS, +3V TO +5.5V, |
11400 |
|
|
Maxim Integrated |
IC LIMITING AMP 20TQFN |
0 |
|
|
Maxim Integrated |
LOW-NOISE, FIBRE CHANNEL TRANSIM |
0 |
|
|
Maxim Integrated |
IC POWER MANAGEMENT |
0 |
|
|
Maxim Integrated |
2.5G LOW POWER TIA WITH VPD RSSI |
46512 |
|
|
Maxim Integrated |
IC AMP LIMITING SFP 10-UMAX |
0 |
|
|
Maxim Integrated |
IC SENSOR |
0 |
|
|
Maxim Integrated |
IC LIMITING AMP DIE |
0 |
|
|
Maxim Integrated |
DOCSIS 3.1 PROGRAMMABLE-GAIN AMP |
0 |
|
|
Maxim Integrated |
IC INTEGRATED CIRCUIT |
0 |
|
|
Maxim Integrated |
IC AMP COMP DIE |
0 |
|
|
Maxim Integrated |
IC PREAMP MICROPHONE SOT23-5 |
0 |
|
|
Maxim Integrated |
MULTI-STAGE DEMODULATING LOGARIT |
0 |
|
|
Maxim Integrated |
IC AMP LIMITING SFP 10-UMAX |
0 |
|
|
Maxim Integrated |
LOW-COST, MICROPOWER, HIGH-SIDE |
0 |
|
|
Maxim Integrated |
2.5GBPS, +3V TO +5.5V, WIDE DYNA |
0 |
|
|
Maxim Integrated |
IC MULTIPHASE MASTER TQFN |
0 |
|
Special purpose linear amplifiers are dedicated analog ICs optimized for specific signal amplification tasks beyond general-purpose operational amplifiers. These devices are engineered to meet stringent performance requirements in specialized applications such as audio processing, radio frequency (RF) transmission, and precision sensing. Their importance in modern technology stems from their ability to deliver tailored electrical characteristics for critical systems in communications, medical equipment, and industrial automation.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Audio Amplifiers | Low THD+N, high efficiency (Class AB/D), wide output swing | Headphone drivers, smart speakers, automotive audio systems |
| RF Amplifiers | High-frequency response (up to 100GHz), impedance matching, low noise figure | 5G base stations, satellite communication systems, test equipment |
| Instrumentation Amplifiers | High CMRR (>100dB), programmable gain, precision DC accuracy | Medical imaging systems, strain gauge interfaces, sensor signal conditioning |
| Power Amplifiers | High output current (up to 10A), thermal protection, voltage swing optimization | Motors drivers, LED lighting systems, industrial actuators |
Typical construction includes: - Package Types: SOP, QFN, BGA, or through-hole configurations with EMI shielding options - Internal Architecture: Differential transistor pairs (BJT/FET), biasing networks, compensation capacitors - Material: Silicon (CMOS/BiCMOS) for standard applications, GaAs/InP for microwave frequencies
| Parameter | Importance |
|---|---|
| Gain Bandwidth Product (GBW) | Determines frequency response range |
| Noise Figure (NF) | Critical for signal integrity in low-level amplification |
| Slew Rate | Affects transient response capability |
| Power Supply Rejection Ratio (PSRR) | Measures immunity to supply voltage fluctuations |
| Manufacturer | Representative Product | Key Specifications |
|---|---|---|
| TI (Burr-Brown) | LMV7239 | Audio amplifier with 0.0008% THD+N, 24-bit audio quality |
| Analog Devices | AD8336 | Variable gain amplifier for ultrasound systems (88dB dynamic range) |
| STMicroelectronics | TDA7498 | 2x70W Class-D audio amplifier for automotive applications |
Key considerations include: - Matching bandwidth requirements with GBW product - Thermal management for power dissipation - Environmental factors (temperature, vibration) - Cost vs. performance trade-offs - Regulatory compliance (EMC/ESD ratings)
Current development trends include: - Integration of digital control interfaces (I2C/PMBus) - Adoption of GaN/SiC technologies for high-power applications - Miniaturization through 3D packaging - Enhanced radiation hardness for aerospace applications - AI-driven adaptive amplification algorithms