| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Intersil (Renesas Electronics America) |
SLIC, 2-4 CONVERSION, PQCC32 |
476 |
|
 |
EIA/ITU PABX SLIC |
3278 |
|
|
 |
TELEPHONE RINGER CIRCUIT, PDSO16 |
2364 |
|
|
 |
Texas Instruments |
320C6201 352PIN BGA REV3.1 FOR A |
14 |
|
 |
ROHM Semiconductor |
IC TELECOM INTERFACE SSOP-B16 |
0 |
|
 |
290MHZ - 980MHZ ISM BAND ASK/FSK |
4931 |
|
|
 |
Roving Networks / Microchip Technology |
IC TELECOM INTERFACE 48QFN |
0 |
|
 |
SLIC |
479 |
|
|
 |
Silicon Labs |
IC TELECOM INTERFACE 38QFN |
0 |
|
 |
Renesas Electronics America |
IC TELECOM INTERFACE 144TQFP |
13 |
|
 |
Silicon Labs |
IC TELECOM INTERFACE 48QFN |
0 |
|
 |
CML Microcircuits |
IC TELECOM INTERFACE 20TSSOP |
91 |
|
 |
XWAY HIGH-END SINGLE-CHIP ADSL2/ |
271 |
|
|
 |
RINGING SLIC FOR ISDN MODEM |
1000 |
|
|
 |
BIT ERROR RATE TESTER (BERT) |
13500 |
|
|
 |
IR (Infineon Technologies) |
ISDN D-CHANNEL EXCH. CONTROLLER |
1884 |
|
 |
IR (Infineon Technologies) |
ISAC-S ISDN ACCESS CONTROLLER |
460 |
|
 |
Maxim Integrated |
IC TELECOM INTERFACE 100LQFP |
90270 |
|
 |
Roving Networks / Microchip Technology |
IC TELECOM INTERFACE 32QFN |
0 |
|
 |
DUSLIC DUAL CHANNEL SUBSCRIBER L |
3450 |
|
Interface ICs for telecom applications serve as critical components enabling signal conversion, protocol translation, and data routing between telecommunication systems and peripheral devices. These ICs ensure compatibility between different electrical standards, support high-speed data transmission, and optimize signal integrity. Their importance in modern technology lies in enabling seamless connectivity across wired/wireless networks, data centers, and industrial communication systems.
| Type | Functional Features | Application Examples |
|---|---|---|
| Line Transceivers | Converts logic signals to line standards (e.g., EIA/TIA-232/485) | Industrial automation, RS-485 networks |
| DSL Transceivers | Supports digital subscriber line protocols (ADSL/VDSL) | Telecom access networks, modems |
| Optical Interface ICs | Converts electrical signals to optical signals (10G-100G) | Optical transceivers, fiber networks |
| Protocol Converters | Translates between communication protocols (CAN, Ethernet, USB) | IoT gateways, embedded systems |
| Wireless Interface ICs | Integrates RF front-end for wireless protocols (5G, LTE) | Mobile base stations, IoT devices |
Typical interface ICs for telecom applications include: - Encapsulation: QFN, TSSOP, BGA packages for thermal and electrical efficiency - Internal Modules: - Signal conditioning circuits (ADC/DAC) - Protocol processing engines - Isolation barriers (for industrial applications) - Power management units - Interface Layers: Physical layer (PHY) transceivers, MAC layer controllers
| Parameter | Description | Importance |
|---|---|---|
| Data Rate | 10Mbps to 100Gbps | Determines transmission capacity |
| Power Consumption | 100mW to 5W | Impacts thermal design and efficiency |
| Operating Temperature | -40 C to +125 C | Ensures reliability in harsh environments |
| Signal Integrity | Low jitter (<1ps RMS), high SNR (>60dB) | Reduces transmission errors |
| Protocol Compatibility | Supports IEEE 802.3, ITU-T G.99x standards | Guarantees interoperability |
Key Industries: - Telecommunications (5G base stations, optical networks) - Industrial Automation (PROFIBUS, Modbus interfaces) - Consumer Electronics (USB-C, HDMI interfaces) - Automotive (CAN FD, Ethernet AVB) - Aerospace (ARINC 429 interface ICs)
Typical Equipment: Routers, optical transceivers, PLCs, IoT gateways, test & measurement instruments
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | DS90UB953-Q1 | 24-bit FPD-Link III, 1.5Gbps |
| STMicroelectronics | VN7640 | Multi-protocol transceiver for CAN FD |
| NXP Semiconductors | TJA1042 | High-speed CAN transceiver |
| Analog Devices | ADM2483 | Isolated RS-485 interface |
| Maxim Integrated | MAX14885E | Rugged RS-485/RS-422 interface |
Consider the following factors:
- Match data rate and protocol requirements (e.g., 10Gbps for optical backhaul)
- Evaluate power budget and thermal constraints
- Confirm compliance with industry standards (FCC, ITU-T)
- Assess integration level (e.g., transceiver + protocol engine)
- Prioritize vendors with long-term supply guarantees
Case Study: Selecting TI's DS90UB953 for automotive camera interface requires evaluating its 1.5Gbps rate, EMI reduction features, and automotive temperature compliance.
- High-speed migration: Transition to 100Gbps+ interfaces driven by 5G and cloud computing
- Integration: System-in-Package (SiP) solutions combining PHY, MAC, and security
- Energy efficiency: Development of sub-100mW interfaces for IoT edge devices
- AI-enabled interfaces: Machine learning-based signal equalization and error correction
- Optical convergence: Silicon photonics integration for data center interconnects