Interface - Modems - ICs and Modules

Part Number	Description / PDF	Quantity
CMX868AD2 CML Microcircuits	V.22BIS MODEM	1460
CMX7143Q3 CML Microcircuits	MULTI-MODE DATA MODEM	411
FX604D4-TR1K CML Microcircuits	V.23 COMPATIBLE MODEM	0
CMX867AE2 CML Microcircuits	LOW-POWER V.22 MODEM	0
MX614TN CML Microcircuits	BELL 202 COMPATIBLE MODEM	53
CMX868AE2 CML Microcircuits	LOW POWER V.22 BIS MODEM	1120
CMX909BE2 CML Microcircuits	GMSK PACKET DATA MODEM	14
CMX865AD4 CML Microcircuits	BASEBAND INTERFACE FOR DIG RADIO	1223
CMX7364Q1 CML Microcircuits	MULTI-MODE HIGH PERFOMANCE MODEM	260
MX614DW CML Microcircuits	BELL 202 COMPATIBLE MODEM	1204
FX614D4 CML Microcircuits	BELL 202 COMPATIBLE MODEM	481
CMX869BE2 CML Microcircuits	LOW-POWER V.32BIS MODEM	285
CMX469AE2 CML Microcircuits	1200/2400/4800BPS FFSK MODEM	2566
CMX7164Q1 CML Microcircuits	MULTI-MODE HIGH PERFORM MODEM	388
CMX589AD5 CML Microcircuits	FULL-DUPLEX GMSK DATA MODEM	95
CMX909BD5 CML Microcircuits	GMSK PACKET DATA MODEM	244
CMX589AD2 CML Microcircuits	FULL-DUPLEX GMSK DATA MODEM	34
CMX868AD2-TR1K CML Microcircuits	V.22BIS MODEM	1000
FX604P3 CML Microcircuits	V.23 COMPATIBLE MODEM	0
FX614P3 CML Microcircuits	BELL 202 COMPATIBLE MODEM	0

Interface - Modems - ICs and Modules

1. Overview

Interface modems ICs and modules are semiconductor devices that enable data communication between digital systems and analog transmission media. They convert digital signals to analog waveforms (modulation) and vice versa (demodulation), ensuring protocol compatibility across wired/wireless networks. These components are critical in telecommunications, industrial automation, IoT ecosystems, and embedded systems, forming the backbone of modern connected infrastructure.

2. Main Types and Functional Classification

Type	Functionality	Application Example
RS-232 Transceivers	Convert TTL/CMOS logic to RS-232 voltage levels for point-to-point communication	Serial ports in industrial controllers
RS-485/422 ICs	Support multi-drop differential signaling for noise-immune long-distance communication	Factory automation networks
CAN Controllers	Implement Controller Area Network protocol for vehicle bus systems	Automotive ECUs, robotics
USB Interface ICs	Bridge USB protocols with microcontrollers or peripheral devices	USB-to-serial converters
Ethernet PHYs	Physical layer transceivers for IEEE 802.3 standards	Industrial Ethernet switches
Wireless Modems	Support GSM/CDMA/LTE/5G protocols with RF front-ends	Telematics, remote monitoring

3. Structure and Composition

Typical components include:

Signal conversion circuits (ADC/DAC, level shifters)
Protocol processing engines (UART, SPI, I2C interfaces)
Power management modules (voltage regulators, LDOs)
Electrostatic discharge (ESD) protection structures
Package types: DIP, SOIC, QFN, BGA

4. Key Technical Specifications

Parameter	Importance
Data Rate	Determines communication speed (e.g., 10Gbps Ethernet PHYs)
Signal Integrity	Measured through jitter and noise immunity
Protocol Compatibility	Ensures adherence to standards (IEEE 802.11, 3GPP)
Power Consumption	Critical for battery-powered IoT devices
Operating Temperature	Industrial (-40 C to +85 C) vs. commercial range
Package Size	Affects PCB integration complexity

5. Application Fields

Industrial Automation: PLCs, SCADA systems
Telecommunications: 5G base stations, fiber optic transceivers
Automotive: CAN-FD networks, V2X communication modules
Consumer Electronics: Smart home gateways, wearables
Medical Devices: Remote patient monitoring systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Texas Instruments	MAX3232 (RS-232 Transceiver)
STMicroelectronics	STMFD CAN FD Controller
Nordic Semiconductor	nRF52840 (Bluetooth 5.2 SoC)
Sierra Wireless	AirPrime EM7455 (LTE-A Module)
Analog Devices	ADM2483 (Isolated RS-485 Transceiver)

7. Selection Guidelines

Key considerations:

Match protocol standards with system requirements
Verify voltage level compatibility (e.g., 1.8V vs. 5V logic)
Evaluate thermal management needs
Assess certification requirements (FCC, CE, ISO 26262)
Balance cost vs. performance metrics

8. Industry Trends

Migration to high-speed SerDes interfaces (PCIe 5.0, USB4)
Integration of AI acceleration in modem SoCs
Expansion of 5G mmWave and Open RAN architectures
Adoption of Time-Sensitive Networking (TSN) in industrial Ethernet
Development of ultra-low-power wake-on-radio capabilities