Interface - Modems - ICs and Modules

Part Number	Description / PDF	Quantity
PEF7072HLV1.6	XWAY PHY11G, 10/100/1000 MBPS E	558
CX11634-11	CONEXANT CX11634 MFP MODEM IC	0
R6785-26	CONEXANT R6785 ACF2 MODEM IC	0
R6785-41	CONEXANT R6785 ACFL MODEM IC	0
RCLXT16706FE Intel	SONET/SDH CELL/PACKET INTERFACE	3556
PSB8224ELV1.1-G	XWAY WAV300 HYPERION III	0
L2702-15	CONEXANT L2702 ACF2 MODEM IC	0
HSP303D	CONEXANT HSP30 HSP PCI MODEM IC	0
PMB9610WV1.0FL	COSICULC: DECT BASE STATION	5173
L5502-11	CONEXANT L5502 ACFL MODEM IC	0
R6764-44	CONEXANT R6764 ACFL MODEM IC	0
R6764-23	CONEXANT R6764 ACFL MODEM IC	0
R6686-11	CONEXANT R6686 FAX 9600 MODEM IC	0
R8295-11	CONEXANT R8295 USB MODEM IC	0
CX81801-64	MODEM, CMOS, PDSO28	26118
PXB4100ELV1.2-G	SINGLE-CHIP SOLUTION FOR GIGABIT	3783
CX81801-62	MODEM, CMOS, PDSO28	35
PMB9603VV1.1FL	COSICPLUS -MODEM DECT/ CAT-IQ	1358
CX88168-11	SMARTSCM SINGLE CHIP MODEM	0
MSC7121ZQF Freescale Semiconductor, Inc. (NXP Semiconductors)	INTEGRATED GPON ONT SYSTEM-ON-CH	1366

Interface - Modems - ICs and Modules

1. Overview

Interface modems ICs and modules are semiconductor devices that enable data communication between digital systems and analog transmission media. They convert digital signals to analog waveforms (modulation) and vice versa (demodulation), ensuring protocol compatibility across wired/wireless networks. These components are critical in telecommunications, industrial automation, IoT ecosystems, and embedded systems, forming the backbone of modern connected infrastructure.

2. Main Types and Functional Classification

Type	Functionality	Application Example
RS-232 Transceivers	Convert TTL/CMOS logic to RS-232 voltage levels for point-to-point communication	Serial ports in industrial controllers
RS-485/422 ICs	Support multi-drop differential signaling for noise-immune long-distance communication	Factory automation networks
CAN Controllers	Implement Controller Area Network protocol for vehicle bus systems	Automotive ECUs, robotics
USB Interface ICs	Bridge USB protocols with microcontrollers or peripheral devices	USB-to-serial converters
Ethernet PHYs	Physical layer transceivers for IEEE 802.3 standards	Industrial Ethernet switches
Wireless Modems	Support GSM/CDMA/LTE/5G protocols with RF front-ends	Telematics, remote monitoring

3. Structure and Composition

Typical components include:

Signal conversion circuits (ADC/DAC, level shifters)
Protocol processing engines (UART, SPI, I2C interfaces)
Power management modules (voltage regulators, LDOs)
Electrostatic discharge (ESD) protection structures
Package types: DIP, SOIC, QFN, BGA

4. Key Technical Specifications

Parameter	Importance
Data Rate	Determines communication speed (e.g., 10Gbps Ethernet PHYs)
Signal Integrity	Measured through jitter and noise immunity
Protocol Compatibility	Ensures adherence to standards (IEEE 802.11, 3GPP)
Power Consumption	Critical for battery-powered IoT devices
Operating Temperature	Industrial (-40 C to +85 C) vs. commercial range
Package Size	Affects PCB integration complexity

5. Application Fields

Industrial Automation: PLCs, SCADA systems
Telecommunications: 5G base stations, fiber optic transceivers
Automotive: CAN-FD networks, V2X communication modules
Consumer Electronics: Smart home gateways, wearables
Medical Devices: Remote patient monitoring systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Texas Instruments	MAX3232 (RS-232 Transceiver)
STMicroelectronics	STMFD CAN FD Controller
Nordic Semiconductor	nRF52840 (Bluetooth 5.2 SoC)
Sierra Wireless	AirPrime EM7455 (LTE-A Module)
Analog Devices	ADM2483 (Isolated RS-485 Transceiver)

7. Selection Guidelines

Key considerations:

Match protocol standards with system requirements
Verify voltage level compatibility (e.g., 1.8V vs. 5V logic)
Evaluate thermal management needs
Assess certification requirements (FCC, CE, ISO 26262)
Balance cost vs. performance metrics

8. Industry Trends

Migration to high-speed SerDes interfaces (PCIe 5.0, USB4)
Integration of AI acceleration in modem SoCs
Expansion of 5G mmWave and Open RAN architectures
Adoption of Time-Sensitive Networking (TSN) in industrial Ethernet
Development of ultra-low-power wake-on-radio capabilities