Interface - Modems - ICs and Modules

Image Part Number Description / PDF Quantity Rfq
R6795-12

R6795-12

CONEXANT R6795 K56 HCF MODEM IC

0

PLF2800EV1.2-INF

PLF2800EV1.2-INF

IR (Infineon Technologies)

PURPLE L2+ ETHERNET SWITCH

0

SI2435-D3-FTR

SI2435-D3-FTR

Silicon Labs

IC ISOMODEM SYSTEM-SIDE 24TSSOP

0

PCT304W-C

PCT304W-C

CONEXANT HSP AC LINK MODEM IC

0

R6775-13

R6775-13

CONEXANT R6775 ACFL MODEM IC

0

PCT303A-C

PCT303A-C

CONEXANT HSP AC LINK MODEM IC

0

SI2535-F-FSR

SI2535-F-FSR

Silicon Labs

IC CLOCK MODEM FAX ISO 16SOIC

0

R6789-22

R6789-22

CONEXANT R6789 USB MODEM IC

0

73M2901CL-IGVR

73M2901CL-IGVR

Analog Devices, Inc.

73M2901 SINGLE-CHIP MODEM

2000

R6790-22

R6790-22

CONEXANT R6790 ACF2 MODEM IC

0

HSP303D-TR

HSP303D-TR

CONEXANT HSP30 HSP PCI MODEM IC

0

R6785-25

R6785-25

CONEXANT R6785 ACF2 MODEM IC

0

PMB9647VV2.0

PMB9647VV2.0

COSIC MODEM KDECT

100129

P9373-12

P9373-12

P9373-12 - SMARTACFL MODEM

0

PSB8305VV1.1

PSB8305VV1.1

XWAY WAV300 WI-FI CHIPSET

0

CMX868AD2-TR1K

CMX868AD2-TR1K

CML Microcircuits

V.22BIS MODEM

1000

SI2435-F-FT

SI2435-F-FT

Silicon Labs

IC ISOMODEM SYSTEM-SIDE 24TSSOP

0

R6758-15

R6758-15

CONEXANT R6758 FAX 14400 IC

0

CX81801-63

CX81801-63

MODEM, CMOS, PDSO28

1613

CX06835-25

CX06835-25

CX06835

0

Interface - Modems - ICs and Modules

1. Overview

Interface modems ICs and modules are semiconductor devices that enable data communication between digital systems and analog transmission media. They convert digital signals to analog waveforms (modulation) and vice versa (demodulation), ensuring protocol compatibility across wired/wireless networks. These components are critical in telecommunications, industrial automation, IoT ecosystems, and embedded systems, forming the backbone of modern connected infrastructure.

2. Main Types and Functional Classification

TypeFunctionalityApplication Example
RS-232 TransceiversConvert TTL/CMOS logic to RS-232 voltage levels for point-to-point communicationSerial ports in industrial controllers
RS-485/422 ICsSupport multi-drop differential signaling for noise-immune long-distance communicationFactory automation networks
CAN ControllersImplement Controller Area Network protocol for vehicle bus systemsAutomotive ECUs, robotics
USB Interface ICsBridge USB protocols with microcontrollers or peripheral devicesUSB-to-serial converters
Ethernet PHYsPhysical layer transceivers for IEEE 802.3 standardsIndustrial Ethernet switches
Wireless ModemsSupport GSM/CDMA/LTE/5G protocols with RF front-endsTelematics, remote monitoring

3. Structure and Composition

Typical components include:

  • Signal conversion circuits (ADC/DAC, level shifters)
  • Protocol processing engines (UART, SPI, I2C interfaces)
  • Power management modules (voltage regulators, LDOs)
  • Electrostatic discharge (ESD) protection structures
  • Package types: DIP, SOIC, QFN, BGA

4. Key Technical Specifications

ParameterImportance
Data RateDetermines communication speed (e.g., 10Gbps Ethernet PHYs)
Signal IntegrityMeasured through jitter and noise immunity
Protocol CompatibilityEnsures adherence to standards (IEEE 802.11, 3GPP)
Power ConsumptionCritical for battery-powered IoT devices
Operating TemperatureIndustrial (-40 C to +85 C) vs. commercial range
Package SizeAffects PCB integration complexity

5. Application Fields

  • Industrial Automation: PLCs, SCADA systems
  • Telecommunications: 5G base stations, fiber optic transceivers
  • Automotive: CAN-FD networks, V2X communication modules
  • Consumer Electronics: Smart home gateways, wearables
  • Medical Devices: Remote patient monitoring systems

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Texas InstrumentsMAX3232 (RS-232 Transceiver)
STMicroelectronicsSTMFD CAN FD Controller
Nordic SemiconductornRF52840 (Bluetooth 5.2 SoC)
Sierra WirelessAirPrime EM7455 (LTE-A Module)
Analog DevicesADM2483 (Isolated RS-485 Transceiver)

7. Selection Guidelines

Key considerations:

  • Match protocol standards with system requirements
  • Verify voltage level compatibility (e.g., 1.8V vs. 5V logic)
  • Evaluate thermal management needs
  • Assess certification requirements (FCC, CE, ISO 26262)
  • Balance cost vs. performance metrics

8. Industry Trends

  • Migration to high-speed SerDes interfaces (PCIe 5.0, USB4)
  • Integration of AI acceleration in modem SoCs
  • Expansion of 5G mmWave and Open RAN architectures
  • Adoption of Time-Sensitive Networking (TSN) in industrial Ethernet
  • Development of ultra-low-power wake-on-radio capabilities
RFQ BOM Call Skype Email
Top