Interface - Modems - ICs and Modules

Part Number	Description / PDF	Quantity
CMX909BD5 CML Microcircuits	GMSK PACKET DATA MODEM	244
73M2901CL-IGT/F Analog Devices, Inc.	73M2901 SINGLE-CHIP MODEM	13973
SI2457-D-FSR Silicon Labs	IC ISOMODEM SYSTEM-SIDE 16SOIC	0
Z0220112VECR4078TR Zilog / Littelfuse	IC MODEM CTRL 2400BPS 44PLCC	0
PXB4219EV3.4 IR (Infineon Technologies)	INTERWORKING ELEMENT FOR 8 E1/T1	234
CMX589AD2 CML Microcircuits	FULL-DUPLEX GMSK DATA MODEM	34
SI2494-A-GMR Silicon Labs	IC ISOMODEM 56KBPS 38-QFN	0
Z0292212VSGR3910 Zilog / Littelfuse	IC MODEM DATA PUMP/AFE 44-PLCC	0
A5191HRTNG-XTP Sanyo Semiconductor/ON Semiconductor	IC HART MODEM CMOS 32QFN	5000
SI2493-D-FSR Silicon Labs	IC ISOMODEM SYSTEM-SIDE 16SOIC	0
SI2415-D-FS Silicon Labs	IC ISOMODEM SYSTEM-SIDE 16SOIC	0
SI2457-D-FTR Silicon Labs	IC ISOMODEM SYSTEM-SIDE 24TSSOP	0
NCN5193MNTWG Sanyo Semiconductor/ON Semiconductor	IC MODEM HARD CMOS 32QFN	26000
Z0220516SSGR3641 Zilog / Littelfuse	IC MODEM CTRL 86E34 28-SOIC	0
CX81801-33	CONEXANT VIDEO AMP 1 CHANNEL	1440
SI2438-B-GT Silicon Labs	IC ISOMODEM 33.6KBPS 24-TSSOP	0
CY8CPLC10-28PVXIT Cypress Semiconductor	IC PLC PSOC CMOS 28SSOP	0
Z0220516SSGR4259 Zilog / Littelfuse	IC MODEM CTRL 86E34 28-SOIC	0
SI2404-D-FT Silicon Labs	IC ISOMODEM SYSTEM-SIDE 24TSSOP	0
PSB8304VV1.1	XWAY WAV300 WI-FI CHIPSET	0

Interface - Modems - ICs and Modules

1. Overview

Interface modems ICs and modules are semiconductor devices that enable data communication between digital systems and analog transmission media. They convert digital signals to analog waveforms (modulation) and vice versa (demodulation), ensuring protocol compatibility across wired/wireless networks. These components are critical in telecommunications, industrial automation, IoT ecosystems, and embedded systems, forming the backbone of modern connected infrastructure.

2. Main Types and Functional Classification

Type	Functionality	Application Example
RS-232 Transceivers	Convert TTL/CMOS logic to RS-232 voltage levels for point-to-point communication	Serial ports in industrial controllers
RS-485/422 ICs	Support multi-drop differential signaling for noise-immune long-distance communication	Factory automation networks
CAN Controllers	Implement Controller Area Network protocol for vehicle bus systems	Automotive ECUs, robotics
USB Interface ICs	Bridge USB protocols with microcontrollers or peripheral devices	USB-to-serial converters
Ethernet PHYs	Physical layer transceivers for IEEE 802.3 standards	Industrial Ethernet switches
Wireless Modems	Support GSM/CDMA/LTE/5G protocols with RF front-ends	Telematics, remote monitoring

3. Structure and Composition

Typical components include:

Signal conversion circuits (ADC/DAC, level shifters)
Protocol processing engines (UART, SPI, I2C interfaces)
Power management modules (voltage regulators, LDOs)
Electrostatic discharge (ESD) protection structures
Package types: DIP, SOIC, QFN, BGA

4. Key Technical Specifications

Parameter	Importance
Data Rate	Determines communication speed (e.g., 10Gbps Ethernet PHYs)
Signal Integrity	Measured through jitter and noise immunity
Protocol Compatibility	Ensures adherence to standards (IEEE 802.11, 3GPP)
Power Consumption	Critical for battery-powered IoT devices
Operating Temperature	Industrial (-40 C to +85 C) vs. commercial range
Package Size	Affects PCB integration complexity

5. Application Fields

Industrial Automation: PLCs, SCADA systems
Telecommunications: 5G base stations, fiber optic transceivers
Automotive: CAN-FD networks, V2X communication modules
Consumer Electronics: Smart home gateways, wearables
Medical Devices: Remote patient monitoring systems

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Texas Instruments	MAX3232 (RS-232 Transceiver)
STMicroelectronics	STMFD CAN FD Controller
Nordic Semiconductor	nRF52840 (Bluetooth 5.2 SoC)
Sierra Wireless	AirPrime EM7455 (LTE-A Module)
Analog Devices	ADM2483 (Isolated RS-485 Transceiver)

7. Selection Guidelines

Key considerations:

Match protocol standards with system requirements
Verify voltage level compatibility (e.g., 1.8V vs. 5V logic)
Evaluate thermal management needs
Assess certification requirements (FCC, CE, ISO 26262)
Balance cost vs. performance metrics

8. Industry Trends

Migration to high-speed SerDes interfaces (PCIe 5.0, USB4)
Integration of AI acceleration in modem SoCs
Expansion of 5G mmWave and Open RAN architectures
Adoption of Time-Sensitive Networking (TSN) in industrial Ethernet
Development of ultra-low-power wake-on-radio capabilities