Interface - Drivers, Receivers, Transceivers

Image Part Number Description / PDF Quantity Rfq
TM1062TX3DUA

TM1062TX3DUA

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

148

TM1062TXHUA

TM1062TXHUA

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

734

TM1062HUB5

TM1062HUB5

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062HUCT

TM1062HUCT

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM266DVA2

TM266DVA2

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM266DSB1

TM266DSB1

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

122

TM266DVB2

TM266DVB2

PulseR (iNRCORE

IC TRANSCEIVER FULL 1/1 28DIPGW

0

TM1062HUXB

TM1062HUXB

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

133

TM1062HSB1

TM1062HSB1

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062TXHUAT

TM1062TXHUAT

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

150

TM1062HSCT

TM1062HSCT

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062HUXBT

TM1062HUXBT

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062DUB2

TM1062DUB2

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062FCA2

TM1062FCA2

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM266DSB2

TM266DSB2

PulseR (iNRCORE

IC TRANSCEIVER FULL 1/1 28DIPGW

0

TM1062DUA1

TM1062DUA1

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062DSB1

TM1062DSB1

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062TX3DUAT

TM1062TX3DUAT

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062DCA

TM1062DCA

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

TM1062FCA1

TM1062FCA1

PulseR (iNRCORE

IC TRANSCEIVER 1/1 MODULE

0

Interface - Drivers, Receivers, Transceivers

1. Overview

Interface drivers, receivers, and transceivers are critical IC components that enable signal transmission between devices in electronic systems. These circuits convert logic signals to appropriate voltage/current levels for reliable communication across different media. They play a vital role in modern electronics by ensuring signal integrity, protocol compatibility, and noise immunity in applications ranging from consumer devices to industrial automation systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Line DriversSignal level translation, impedance matching, differential signalingRS-485/RS-422 communication systems
Logic BuffersSignal amplification, fan-out control, voltage translationDigital circuit interfacing
Differential TransceiversHigh noise immunity, differential signal conversionEthernet (10BASE-T1L), CAN FD
IO-Link TransceiversBi-directional communication, parameter configurationIndustrial sensor networks

3. Structure and Composition

Typical physical structures include TSSOP, SOIC, and QFN packages with 8-64 pins. Key technical components:

  • Input protection circuits (ESD/clamp diodes)
  • Signal conditioning amplifiers
  • Voltage reference generators
  • Differential line drivers with current limiting
  • Receiver hysteresis control circuits
  • Protocol-specific encoding/decoding logic

4. Key Technical Specifications

ParameterImportance
Transmission Rate (Mbps)Determines maximum data throughput capability
Supply Voltage Range (V)Defines compatibility with system power architecture
Propagation Delay (ns)Affects system timing accuracy
Common-Mode Voltage RangeSpecifies noise immunity in industrial environments
ESD Rating (kV)Reliability indicator for harsh operating conditions
Power Consumption (mW)Key factor for battery-powered devices

5. Application Fields

Major application sectors:

  • Industrial Automation: PLCs, motor drives, fieldbuses
  • Automotive: CAN/LIN networks, ADAS sensors
  • Telecommunications: Optical modules, base stations
  • Consumer Electronics: Display interfaces, wearables
  • Aerospace & Defense: Avionics data buses

6. Leading Manufacturers and Products

ManufacturerProduct ExampleKey Features
Texas InstrumentsSN65HVD2303.3V CAN transceiver with 16Mbps rate
NXP SemiconductorsTJA1051High-speed CAN transceiver with partial networking
STMicroelectronicsL9963Battery cell interface IC with SPI communication
Analog DevicesADM2483Isolated RS-485 transceiver with integrated power

7. Selection Guidelines

Key factors for component selection:

  • Protocol compatibility (CAN, RS-485, LVDS, etc.)
  • Environmental requirements (temperature range, ESD protection)
  • Power budget constraints
  • PCB space limitations
  • Signal integrity requirements (jitter, skew)
  • EMI/EMC compliance needs

8. Industry Trends

Current development directions:

  • Increased integration with protocol accelerators
  • Higher data rates (>1Gbps) for 5G and automotive applications
  • Advanced packaging for reduced parasitics
  • Energy-efficient designs for IoT devices
  • Enhanced diagnostics and fault reporting capabilities
  • Optical interface integration for isolation applications
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