Interface - Drivers, Receivers, Transceivers

Image Part Number Description / PDF Quantity Rfq
MAX3222IDWR

MAX3222IDWR

Texas Instruments

IC TRANSCEIVER FULL 2/2 20SOIC

196

54LS138LMQB

54LS138LMQB

DECODER/DRIVER

252

ISL31472EIBZ

ISL31472EIBZ

Intersil (Renesas Electronics America)

IC TRANSCEIVER HALF 1/1 8SOIC

0

SN65LVDS32BD

SN65LVDS32BD

Texas Instruments

IC RECEIVER 0/4 16SOIC

208

MAX218CWP+T

MAX218CWP+T

Maxim Integrated

IC TRANSCEIVER FULL 2/2 20SOIC

0

LT1796IN8#PBF

LT1796IN8#PBF

IC TRANSCEIVER HALF 1/1 8DIP

200

NCV7340D14R2G

NCV7340D14R2G

Sanyo Semiconductor/ON Semiconductor

IC TRANSCEIVER HALF 1/1 8SOIC

0

ICL3225IA-T

ICL3225IA-T

Intersil (Renesas Electronics America)

IC TRANSCEIVER FULL 2/2 20SSOP

5650

MC74LVX4245DWR2

MC74LVX4245DWR2

IC TRANSCEIVER 8/8 24SOIC

10040

MLX80050KDC-CAA-100-SP

MLX80050KDC-CAA-100-SP

Melexis

IC TRANSCEIVER 5V 70MA 8SOIC

0

MAX3345EEUE+T

MAX3345EEUE+T

Maxim Integrated

IC TRANSCEIVER FULL 1/1 16TSSOP

0

HD1-6436-2

HD1-6436-2

CMOS OCTAL BUS BUFFER/DRIVER

625

SN65HVD1050AQDRQ1

SN65HVD1050AQDRQ1

Texas Instruments

IC TRANSCEIVER HALF 1/1 8SOIC

1416

MAX13053AEASA+

MAX13053AEASA+

Maxim Integrated

IC TRANSCEIVER FULL 1/1 8SOIC

3613000

FIN1001M5X

FIN1001M5X

Sanyo Semiconductor/ON Semiconductor

IC DRIVER 1/0 SOT23-5

0

MAX242CAP

MAX242CAP

Analog Devices, Inc.

IC TRANSCEIVER FULL 2/2 20SSOP

0

DS91C180TMAX/NOPB

DS91C180TMAX/NOPB

Texas Instruments

IC TRANSCEIVER FULL 1/1 14SOIC

0

MAX3075EEPA

MAX3075EEPA

Analog Devices, Inc.

RS-485/RS-422 TRANSCVR

1630

XR33158HD-F

XR33158HD-F

MaxLinear

IC TRANSCEIVER HALF 1/1 8SOIC

0

SN75LBC771DW

SN75LBC771DW

Texas Instruments

IC TRANSCEIVER FULL 2/3 20SOIC

21807

Interface - Drivers, Receivers, Transceivers

1. Overview

Interface drivers, receivers, and transceivers are critical IC components that enable signal transmission between devices in electronic systems. These circuits convert logic signals to appropriate voltage/current levels for reliable communication across different media. They play a vital role in modern electronics by ensuring signal integrity, protocol compatibility, and noise immunity in applications ranging from consumer devices to industrial automation systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Line DriversSignal level translation, impedance matching, differential signalingRS-485/RS-422 communication systems
Logic BuffersSignal amplification, fan-out control, voltage translationDigital circuit interfacing
Differential TransceiversHigh noise immunity, differential signal conversionEthernet (10BASE-T1L), CAN FD
IO-Link TransceiversBi-directional communication, parameter configurationIndustrial sensor networks

3. Structure and Composition

Typical physical structures include TSSOP, SOIC, and QFN packages with 8-64 pins. Key technical components:

  • Input protection circuits (ESD/clamp diodes)
  • Signal conditioning amplifiers
  • Voltage reference generators
  • Differential line drivers with current limiting
  • Receiver hysteresis control circuits
  • Protocol-specific encoding/decoding logic

4. Key Technical Specifications

ParameterImportance
Transmission Rate (Mbps)Determines maximum data throughput capability
Supply Voltage Range (V)Defines compatibility with system power architecture
Propagation Delay (ns)Affects system timing accuracy
Common-Mode Voltage RangeSpecifies noise immunity in industrial environments
ESD Rating (kV)Reliability indicator for harsh operating conditions
Power Consumption (mW)Key factor for battery-powered devices

5. Application Fields

Major application sectors:

  • Industrial Automation: PLCs, motor drives, fieldbuses
  • Automotive: CAN/LIN networks, ADAS sensors
  • Telecommunications: Optical modules, base stations
  • Consumer Electronics: Display interfaces, wearables
  • Aerospace & Defense: Avionics data buses

6. Leading Manufacturers and Products

ManufacturerProduct ExampleKey Features
Texas InstrumentsSN65HVD2303.3V CAN transceiver with 16Mbps rate
NXP SemiconductorsTJA1051High-speed CAN transceiver with partial networking
STMicroelectronicsL9963Battery cell interface IC with SPI communication
Analog DevicesADM2483Isolated RS-485 transceiver with integrated power

7. Selection Guidelines

Key factors for component selection:

  • Protocol compatibility (CAN, RS-485, LVDS, etc.)
  • Environmental requirements (temperature range, ESD protection)
  • Power budget constraints
  • PCB space limitations
  • Signal integrity requirements (jitter, skew)
  • EMI/EMC compliance needs

8. Industry Trends

Current development directions:

  • Increased integration with protocol accelerators
  • Higher data rates (>1Gbps) for 5G and automotive applications
  • Advanced packaging for reduced parasitics
  • Energy-efficient designs for IoT devices
  • Enhanced diagnostics and fault reporting capabilities
  • Optical interface integration for isolation applications
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