Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
GX4002-INE3

GX4002-INE3

Semtech

IC CROSSPOINT SWITCH 2:2 32QFN

434

MAX4587EUB+

MAX4587EUB+

Maxim Integrated

IC AUDIO/VIDEO MUXI 4X1 10UMAX

263

MAX4567EEE+

MAX4567EEE+

Maxim Integrated

IC VIDEO SWITCH DUAL SPDT 16QSOP

2514700

TSU6712YFPRB

TSU6712YFPRB

Texas Instruments

TSU6712 SP4T SWITCH WITH IMPEDAN

128911

VSC3304YHV-01

VSC3304YHV-01

Roving Networks / Microchip Technology

IC CROSSPOINT SWITCH 4:4 36FCBGA

241

ISL54200IRZ

ISL54200IRZ

Intersil (Renesas Electronics America)

IC USB SWITCH DUAL SPDT 10TDFN

0

MAX4584EUB+T

MAX4584EUB+T

Maxim Integrated

IC AUDIO/VIDEO SWITCH 10UMAX

0

PI3USB221AZWEX

PI3USB221AZWEX

Zetex Semiconductors (Diodes Inc.)

IC USB2 SWITCH 3V UDFN3030-10

283

ADG751BRTZ-REEL7

ADG751BRTZ-REEL7

Analog Devices, Inc.

IC VIDEO SWITCH SPST SOT23-6

1095

PEX8617-BA50BC G

PEX8617-BA50BC G

Broadcom

PEX8617-BA50BC G

36

FSA2367MTCX-ON

FSA2367MTCX-ON

LOW RON (0.75 OHM) TRIPLE SPDT,

0

PI3DBS12212AZBSEX

PI3DBS12212AZBSEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 2:4 20TQFN

45390

CBTL06DP213EE,118

CBTL06DP213EE,118

NXP Semiconductors

IC MUX 6CH DISPLAY PORT 48TFBGA

3897

PEX8609-BA50BI G

PEX8609-BA50BI G

Broadcom

IC PCI EXPRESS SWITCH 196BGA

0

ADG2128BCPZ-HS-RL7

ADG2128BCPZ-HS-RL7

Analog Devices, Inc.

IC CROSSPOINT SWIT 8X12 32LFCSP

0

PEX8604-BA50BI G

PEX8604-BA50BI G

Broadcom

IC PCI EXPRESS SWITCH 196BGA

0

MAX7457ETE+

MAX7457ETE+

Analog Devices, Inc.

VIDEO SWITCH FOR DUAL SCART

12652

PEX8680-AA50RBC G

PEX8680-AA50RBC G

Broadcom

IC PCI EXPRESS SWITCH 1156FCBGA

0

MAX4566ESE

MAX4566ESE

Analog Devices, Inc.

BIDIRECTIONAL RF/VIDEO SWITCH

1386

LMH6570MAX/NOPB

LMH6570MAX/NOPB

Texas Instruments

LMH6570 2:1 HIGH SPEED VIDEO MUL

3473

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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