Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MCIMX31CJMN4D

MCIMX31CJMN4D

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX31 32-BIT MPU, ARM1136JF-S C

397

P2010NSE2KFC

P2010NSE2KFC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32-BIT POWER ARCH SOC, 10

444

MPC8545EPXAQGB

MPC8545EPXAQGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

1

MC9328MX21VM

MC9328MX21VM

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32 BIT, 266MHZ,

0

P5010NSN1QMB

P5010NSN1QMB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 64 BIT POWER ARCH SOC, 1.

24

MPC862PCVR66B

MPC862PCVR66B

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

616

MC7447AVS733NB

MC7447AVS733NB

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

38

P5010NSN1MMB

P5010NSN1MMB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ INTEGRATED COMMUNICATION P

26

P2020PSE2HZB

P2020PSE2HZB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

31

MC9S12HZ256CPV

MC9S12HZ256CPV

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, CPU12 CPU, 25MHZ

126

P1016NSN5DFB

P1016NSN5DFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

44

P2040NSN7KLC

P2040NSN7KLC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32-BIT POWER ARCH SOC, 4

0

MPC8572EVTAVNE

MPC8572EVTAVNE

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

308

MCIMX31CVKN5D

MCIMX31CVKN5D

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX31 32-BIT MPU, ARM1136JF-S C

34

MC68EN360AI33L-FR

MC68EN360AI33L-FR

Freescale Semiconductor, Inc. (NXP Semiconductors)

QUICC COMMUNICATIONS CONTROLLER,

42

SPC5200CVR400-FR

SPC5200CVR400-FR

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 400MHZ, CMOS, PB

40

MCIMX7S3DVK08SC557

MCIMX7S3DVK08SC557

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 7SOLO:1X CORTEX A7, 1X USB

0

P1024NSE5DFB

P1024NSE5DFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, POWER ARCH 32-BIT SOC, 2

840

MPC8275CVRMIBA

MPC8275CVRMIBA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

112

MCIMX27LVOP4A

MCIMX27LVOP4A

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX27 32 BIT MICROPROCESSOR, AR

17

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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