Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MPC8572EVTAULB

MPC8572EVTAULB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1333MHZ, PBGA1023

188

MVF50NN151CMK50

MVF50NN151CMK50

Freescale Semiconductor, Inc. (NXP Semiconductors)

VYBRID F 32-BIT MPU, ARM CORTEX-

0

MCIMX353DVM5B

MCIMX353DVM5B

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX35 32-BIT MPU, ARM1136JF-S C

90

MCIMX6L8DVN10ABR

MCIMX6L8DVN10ABR

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32-BIT MPU ARM CO

3000

MPC8536EAVTATH

MPC8536EAVTATH

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1250MHZ, PBGA783

0

MPC8245LZU266D

MPC8245LZU266D

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROCONTROLLER, 32 BIT, PO

24028

MPC880CVR66

MPC880CVR66

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

790

MPC8343CVRADDB

MPC8343CVRADDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC II PRO PROCESSOR

3

MPC8308CVMAGD

MPC8308CVMAGD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 266MHZ, PBGA473

0

MPC8260AZUPIBB

MPC8260AZUPIBB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

2

MPC8241LZQ266D

MPC8241LZQ266D

Freescale Semiconductor, Inc. (NXP Semiconductors)

32 BIT POWER ARCHITECTURE

26

MPC8343VRAGDB

MPC8343VRAGDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC II PRO PROCESSOR

120

MCIMX257DJM4

MCIMX257DJM4

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, CMOS, PBGA400

109

MPC8347CZUAJDB

MPC8347CZUAJDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32-BIT, 533MHZ,

353

MCIMX255AJM4AR2

MCIMX255AJM4AR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX25 32-BIT MPU, ARM926EJ-S CO

0

MC68LC302AF16CT

MC68LC302AF16CT

Freescale Semiconductor, Inc. (NXP Semiconductors)

INTEGRATED MULTIPROTOCOL MICROPR

360

MPC8547VTAUJB

MPC8547VTAUJB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1333MHZ, PBGA783

233

MPC8323VRAFDC

MPC8323VRAFDC

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 333MHZ, CMOS, PBGA516

1960

MC68020CRC16E

MC68020CRC16E

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 16.67MHZ

4

MC68302CAG16VC

MC68302CAG16VC

Freescale Semiconductor, Inc. (NXP Semiconductors)

INTEGRATED MULTIPROTOCOL MICROPR

398

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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