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Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MIMX8MM1DVTLZAA

MIMX8MM1DVTLZAA

NXP Semiconductors

I.MX 8M MINI SOLOLITE

152
MC8640TVJ1067NE

MC8640TVJ1067NE

NXP Semiconductors

IC MPU E600 SGL CORE 994FCCBGA

0
ATSAMA5D22C-CU

ATSAMA5D22C-CU

Roving Networks / Microchip Technology

IC MCU 32BIT EXT MEM 196TFBGA

130
AM2971ADC

AM2971ADC

MICROPROCESSOR CIRCUIT, CMOS

64
OMAP3525ECBCA

OMAP3525ECBCA

Texas Instruments

IC MPU OMAP-35XX 600MHZ 515FCBGA

0
HD64F3437TF16V

HD64F3437TF16V

Renesas Electronics America

8-BIT, FLASH, 16MHZ

348
AM3715CUS

AM3715CUS

Texas Instruments

AM3715 SITARA PROCESSOR: ARM COR

1197
25PPC750CX-DP0523T

25PPC750CX-DP0523T

IBM25PPC750 - POWERPC 750CX

8
MPC8271VRTIEA

MPC8271VRTIEA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

200
N80960SA16

N80960SA16

Intel

32-BIT, 16MHZ, CMOS, PQCC84

931
MC68HC908QT1CFQ

MC68HC908QT1CFQ

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, FLASH, 68HC08 CPU, 8MHZ

1788
MC68HC000EI20

MC68HC000EI20

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 20MHZ, CMOS, PQCC68

8808
XPC8240LVV200E

XPC8240LVV200E

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

6
P1010NSN5HFA

P1010NSN5HFA

NXP Semiconductors

IC MPU Q OR IQ 1.0GHZ 425TEBGA

0
MC68302CEH16C

MC68302CEH16C

Freescale Semiconductor, Inc. (NXP Semiconductors)

INTEGRATED MULTIPROTOCOL MICROPR

70
KMPC8314EVRAGDA

KMPC8314EVRAGDA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC II MICROPROCESSOR(MPC

0
MCIMX6G1CVM05ABR

MCIMX6G1CVM05ABR

NXP Semiconductors

I.MX 32-BIT MPU ARM CORTEX-A7 C

0
MPC8536BVJAVLA

MPC8536BVJAVLA

NXP Semiconductors

IC MPU MPC85XX 1.5GHZ 783FCBGA

36
MPC8321CVRADDCA

MPC8321CVRADDCA

NXP Semiconductors

IC MPU MPC83XX 266MHZ 516BGA

0
IS80C286-12

IS80C286-12

Intersil (Renesas Electronics America)

MPU WITH MEMORY MANAGEMENT

0

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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