Embedded - FPGAs (Field Programmable Gate Array)

Part Number	Description / PDF	Quantity
EP1S10B672C6 Altera (Intel)	EP1S10 - STRATIX FPGA	28
EPF81500AQC240-2N Altera (Intel)	LOADABLE PLD, 1.7NS PQFP240	90
EP2S60F1020C4 Altera (Intel)	IC FPGA 718 I/O 1020FBGA	0
EP3C16F256C7N Altera (Intel)	IC FPGA 168 I/O 256FBGA	576
EP20K300EBC652-1 Altera (Intel)	LOADABLE PLD, 1.68NS, PBGA652	7
EPF10K200SFC484-3 Altera (Intel)	LOADABLE PLD, 0.8NS PBGA484	61
EP2C5Q208C8N Altera (Intel)	IC FPGA 142 I/O 208QFP	1174
EPF10K100EFC484-1X Altera (Intel)	LOADABLE PLD, 0.4NS PBGA484	239
EPF10K200SBC356-2 Altera (Intel)	LOADABLE PLD, 0.6NS PBGA356	38
EP2S15F672C5 Altera (Intel)	IC FPGA 366 I/O 672FBGA	0
EP2A70B724C8 Altera (Intel)	LOADABLE PLD, 2.49NS, PBGA724	11
EP20K400CF672C9 Altera (Intel)	EP20K400 - APEX 20KC PLD	215
EPF10K50SQC240-1 Altera (Intel)	LOADABLE PLD, 0.3NS PQFP240	300
EP2S90F780C5 Altera (Intel)	FPGA, 36384 CLBS, 640MHZ, 90960-	225
EPF10K130EFC484-2N Altera (Intel)	LOADABLE PLD, 0.5NS PBGA484	393
EP20K200EFC672-1 Altera (Intel)	EP20K200 - APEX 20KE PLD	67
EP20K200EQC240-2N Altera (Intel)	LOADABLE PLD, 1.97NS PQFP240	105
EP2SGX30DF780C5 Altera (Intel)	IC FPGA 361 I/O 780FBGA	0
EPF10K130EBC356-2 Altera (Intel)	LOADABLE PLD, 0.5NS PBGA356	31
EP20K200EQC240-3N Altera (Intel)	LOADABLE PLD, 2.33NS PQFP240	27

Embedded - FPGAs (Field Programmable Gate Array)

1. Overview

Field Programmable Gate Arrays (FPGAs) are reconfigurable semiconductor devices containing programmable logic blocks and interconnects. They enable hardware-level customization for specific computational tasks, offering flexibility unmatched by ASICs or microprocessors. In modern technology, FPGAs are critical for applications requiring parallel processing, low-latency execution, and real-time adaptability, such as AI acceleration, 5G communications, and industrial automation.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Low-Cost FPGAs	Optimized for budget-sensitive applications with minimal logic density	Consumer electronics, IoT edge devices
High-Performance FPGAs	Advanced DSP blocks, high-speed transceivers (>100 Gbps)	Data centers, radar systems
SoC FPGAs	Integrated ARM processors with FPGA fabric	Industrial control, medical imaging
MPSoC FPGAs	Multi-core processors with AI acceleration engines	Autonomous vehicles, 5G base stations

3. Architecture and Components

A typical FPGA consists of:

Logic Units: Configurable Lookup Tables (LUTs) and flip-flops for implementing Boolean functions
Routing Resources: Programmable interconnects for signal pathways
I/O Interfaces: Standardized protocols (PCIe, DDR4, Ethernet)
Embedded Memory: Block RAM and distributed RAM for data storage
Clock Management: Phase-Locked Loops (PLLs) for precise timing control
DSP Blocks: Hardened multipliers and accumulators for signal processing

4. Key Technical Specifications

Parameter	Description	Importance
Logic Cells	Number of configurable logic units (10K 2M+)	Determines computational complexity
Max Frequency	Operating speed (100 MHz 1 GHz)	Impacts processing throughput
Power Consumption	Thermal Design Power (TDP: 1W 100W)	Critical for battery-powered systems
Package Type	BGA, Flip-Chip, System-in-Package (SiP)	Affects PCB integration
Memory Bandwidth	Data transfer rate (10 GB/s 1 TB/s)	Essential for AI/data-intensive tasks

5. Application Domains

Telecommunications: 5G NR base stations, optical network switches
Industrial: Motor control, machine vision systems
Automotive: ADAS sensor fusion, LiDAR processing
Healthcare: MRI image reconstruction, ultrasound beamforming
Aerospace: Satellite communication modems, flight control systems

6. Leading Manufacturers and Products

Vendor	Representative Product	Key Features
Xilinx	Zynq UltraScale+ MPSoC	Quad-core ARM Cortex-A53 + 1.6M logic cells
Intel	Stratix 10 GX	10M logic elements, 14 Gbps transceivers
Lattice	MachXO3D	Low-power <100K LUTs with security features
Microchip	PolarFire SoC	256-bit RISC-V processor, 4.9M logic cells

7. Selection Guidelines

Key considerations:

Evaluate required logic density and I/O bandwidth
Balance performance vs. power budget (e.g., automotive vs. data center)
Assess toolchain support (Vivado, Quartus, etc.)
Consider long-term availability for industrial/medical systems
Verify protocol compatibility (e.g., PCIe Gen5, DDR5)

8. Industry Trends

Future directions include:

AI-optimized FPGAs with integrated tensor cores
3D-stacked memory integration for >1 TB/s bandwidth
Open-source toolchain adoption (e.g., GHDL, Yosys)
Heterogeneous computing with hybrid CPU-GPU-FPGA architectures
Advanced node processes (5nm/3nm) enabling 10M+ logic cells