Embedded - DSP (Digital Signal Processors)

Image Part Number Description / PDF Quantity Rfq
MSC7118VF1200

MSC7118VF1200

NXP Semiconductors

DSP 16BIT W/DDR CTRLR 400-MAPBGA

0

PC8144EVT800

PC8144EVT800

NXP Semiconductors

DSP 800MHZ LOW TEMP 783BGA

0

KMSC8122VT8000

KMSC8122VT8000

NXP Semiconductors

DSP 16BIT QUAD 500MHZ 431FCBGA

0

XC56309VL100AR2

XC56309VL100AR2

NXP Semiconductors

IC DSP 24BIT 100MHZ 196-MAPBGA

0

MSC8112TMP2400V

MSC8112TMP2400V

NXP Semiconductors

DSP DUAL CORE 431FCBGA

0

MSC7112VM800

MSC7112VM800

NXP Semiconductors

IC DSP PROCESSOR 16BIT 400MAPBGA

0

DSP56311VF150R2

DSP56311VF150R2

NXP Semiconductors

IC DSP 24BIT 150MHZ 196-BGA

0

MSC7110VM1000

MSC7110VM1000

NXP Semiconductors

DSP 16BIT W/DDR CTRLR 400-MAPBGA

0

MSC8154SAG1000B

MSC8154SAG1000B

NXP Semiconductors

IC DSP 4X 1GHZ SC3850 783FCBGA

0

DSP56321VF200R2

DSP56321VF200R2

NXP Semiconductors

IC DSP 24BIT 200MHZ 196MAPBGA

0

MSC8251SAG1000B

MSC8251SAG1000B

NXP Semiconductors

IC DSP 1X 1GHZ SC3850 783FCBGA

0

SAF7741HV/N140ZY

SAF7741HV/N140ZY

NXP Semiconductors

IC HD RADIO PROCESSOR 144HLQFP

0

DSP56301AG80B1

DSP56301AG80B1

NXP Semiconductors

IC DSP 24BIT 80MHZ GP 208-LQFP

0

MSC7110VM800

MSC7110VM800

NXP Semiconductors

IC DSP PROCESSOR 16BIT 400MAPBGA

0

DSP56311VL150R2

DSP56311VL150R2

NXP Semiconductors

IC DSP 24BIT 150MHZ 196-MAPBGA

0

DSP56311VL150B1

DSP56311VL150B1

NXP Semiconductors

IC DSP 24BIT 150MHZ 196-MAPBGA

0

MSC8126TMP6400

MSC8126TMP6400

NXP Semiconductors

DSP 16BIT 400MHZ MULTI 431FCBGA

0

KMC8144VT1000A

KMC8144VT1000A

NXP Semiconductors

IC DSP 783FCBGA

0

SPAKXC309AG100A

SPAKXC309AG100A

NXP Semiconductors

IC DSP 24BIT 100MHZ 144-LQFP

0

SAA7709H/N106S,518

SAA7709H/N106S,518

NXP Semiconductors

IC DSP CAR RADIO 80QFP

0

Embedded - DSP (Digital Signal Processors)

1. Overview

Digital Signal Processors (DSPs) are specialized microprocessors optimized for high-speed numerical calculations required in signal processing. Embedded DSPs integrate these capabilities into compact systems, enabling real-time processing of analog and digital signals. They play a critical role in modern technologies by enabling tasks like audio/video compression, noise reduction, radar imaging, and AI inference. Their ability to perform complex mathematical operations (e.g., FFTs, convolutions) at low power makes them indispensable in applications ranging from consumer electronics to industrial automation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
General-Purpose DSP Balanced performance for common signal processing tasks Audio codecs, motor control systems
High-Performance DSP Multi-core architectures with teraflop-level processing Radar systems, 5G base stations
Low-Power DSP Optimized for energy efficiency (sub-1W operation) IoT sensors, wearable devices
Fixed-Point DSP Integer arithmetic for cost-sensitive applications Entry-level automotive systems
Floating-Point DSP High precision for complex algorithms Medical imaging, scientific instruments

3. Structure and Composition

A typical embedded DSP system includes:

  • Core Architecture: Modified Harvard architecture with separate instruction/data buses
  • Memory Hierarchy: L1/L2 cache, on-chip SRAM, external DDR interfaces
  • Accelerators: SIMD units, VLIW engines, FFT hardware
  • Interfaces: SPI, I2C, PCIe, JTAG for debugging
  • Power Management: DVFS (Dynamic Voltage/Frequency Scaling)

Advanced packages like BGA and QFN enable high pin density while maintaining thermal efficiency.

4. Key Technical Specifications

Parameter Description and Importance
Processing Speed (MIPS/GFLOPS) Determines real-time processing capability
Word Length (16/32/64-bit) Affects dynamic range and precision
Power Consumption (mW/MHz) Crucial for battery-powered devices
Memory Bandwidth (GB/s) Limits throughput in data-intensive tasks
Thermal Design Power (TDP) Dictates cooling requirements

5. Application Fields

  • Telecommunications: 5G NR modems, optical network transceivers
  • Consumer Electronics: Smart speakers (Amazon Echo), AR headsets
  • Industrial: Predictive maintenance sensors, robotic vision systems
  • Medical: Ultrasound machines, ECG analyzers
  • Automotive: LiDAR processing for ADAS, engine control units

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Specifications
Texas Instruments TMS320C6678 8-core DSP, 16 GMACS, 10-band spectral analysis
Analog Devices ADSP-BF707 256-bit LPDDR memory bus, hardware accelerators
NXP Semiconductors S32K144H Arm Cortex-M4F core, ASIL-D functional safety
Intel Turbo DSP C6XX Dynamic core scaling, PCIe Gen4 interface

7. Selection Guidelines

Key considerations include:

  • Algorithm Complexity: Floating-point for radar beamforming vs. fixed-point for voice codecs
  • Real-Time Constraints: Deterministic latency requirements
  • Power Budget: 150mW for hearables vs. 25W for base stations
  • Development Ecosystem: Availability of optimized libraries (e.g., TI's DSP/BIOS)
  • Scalability: Pin-to-pin compatible families for future upgrades

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (e.g., Google Edge TPU)
  • 7nm process nodes enabling 10TOPS/Watt efficiency
  • Adoption of RISC-V architecture for customizable DSPs
  • Increased use in edge computing for Industry 4.0 systems
  • Advanced packaging (2.5D/3D) for heterogeneous integration

Market projections indicate a CAGR of 6.2% through 2027, driven by automotive radar and AIoT applications.

9. Practical Application Case

Case: Smart Speaker Audio Processing
A leading smart speaker uses ADI's SHARC DSP for beamforming and noise suppression. The DSP processes 8-channel microphone inputs in real-time, achieving 40dB noise reduction while maintaining 15ms latency. Its low-power mode consumes 85mW during voice activity detection, extending Wi-Fi-enabled device battery life by 30% compared to GPU-based solutions.

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