Clock/Timing - Real Time Clocks

Part Number	Description / PDF	Quantity
DS1337+ Maxim Integrated	IC RTC CLK/CALENDAR I2C 8-DIP	528550
DS1558Y+ Maxim Integrated	IC RTC CLK/CALENDAR PAR 48-LQFP	255750
DS3231MZ/V+ Maxim Integrated	IC RTC CLK/CALENDAR I2C 8-SOIC	0
DS1673S-5+ Maxim Integrated	IC RTC SYSTEM CTRLR SER 20-SOIC	842808
DS1501WZN+T&R Maxim Integrated	IC RTC CLK/CALENDAR PAR 28-SOIC	11461000
DS1746WP-120+ Maxim Integrated	IC RTC CLK/CALENDAR PAR 34-PCM	88
DS1347T+T&R Maxim Integrated	IC RTC CLK/CALENDAR SPI 8-TDFN	5732500
DS1554-70+ Maxim Integrated	IC RTC CLK/CALENDAR PAR 32-EDIP	524
DS1556W-120+ Maxim Integrated	IC RTC CLK/CALENDAR PAR 32-EDIP	331496
DS3234S#T&R Maxim Integrated	IC RTC CLK/CALENDAR SPI 20-SOIC	303
DS1305N+ Maxim Integrated	IC RTC CLK/CALENDAR SPI 16-DIP	216500
DS17487-5IND+ Maxim Integrated	IC RTC CLK/CALENDAR PAR 24-EDIP	99
DS1344D-18+ Maxim Integrated	IC RTC CLK/CAL SPI 14TDFN	0
DS1374C-33# Maxim Integrated	IC RTC BINARY CNT I2C 16-SOIC	371
DS1557WP-120IND+ Maxim Integrated	IC RTC CLK/CALENDAR PAR 34-PCM	84440
DS1306E+ Maxim Integrated	IC RTC CLK/CALENDAR SPI 20-TSSOP	276
DS1388Z-3+T&R Maxim Integrated	IC RTC CLK/CALENDAR I2C 8-SOIC	0
DS1554W-120IND+ Maxim Integrated	IC RTC CLK/CALENDAR PAR 32-EDIP	363
DS1244W-120+ Maxim Integrated	IC RTC PHANTOM PAR 28-DIP	23672
DS1390U-33+T&R Maxim Integrated	IC RTC CLK/CALENDAR SPI 10-USOP	24346

Clock/Timing - Real Time Clocks

1. Overview

Real-Time Clocks (RTCs) are integrated circuits designed to maintain accurate timekeeping in electronic systems, even during power interruptions. They provide critical time-of-day, date, and alarm functions through battery-backed or capacitor-powered circuits. RTCs are essential for applications requiring precise temporal synchronization in embedded systems, consumer electronics, industrial automation, and automotive systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Parallel Interface RTCs	8/16-bit parallel data buses, fast access	Industrial controllers, legacy systems
I2C/SPI Interface RTCs	Serial communication, low pin count	Smartphones, IoT devices
Embedded Crystal RTCs	Integrated crystal oscillator, reduced footprint	Wearables, medical devices
Low-Power RTCs	Sub-1 A standby current, extended battery life	Energy harvesting systems, sensors

3. Structure and Components

Typical RTC architecture includes:

32.768kHz crystal oscillator circuit
Binary counter with BCD/time registers
Power supply monitoring and switching circuitry
Communication interface (I2C, SPI, etc.)
Alarm and interrupt generation modules
Temperature compensation circuitry (for high-precision variants)

Common packaging: 8-24 pin DIP/SOP/TSSOP, with optional integrated crystal in QFN packages.

4. Key Technical Specifications

Parameter	Importance	Typical Values
Timekeeping Accuracy	Determines cumulative error over time	2ppm (0 C-40 C), 20ppm industrial
Supply Current	Impacts battery life	800nA-2 A @ 3V
Operating Temperature	Defines environmental reliability	-40 C to +85 C standard
Interface Speed	Limits system communication bandwidth	400kHz I2C, 10MHz SPI
Timekeeping Voltage	Determines minimum operation threshold	1.3V-3.7V

5. Application Areas

Key industries and equipment:

Consumer Electronics: Smartphones, Set-top boxes, Digital cameras
Industrial Automation: PLCs, SCADA systems, Data loggers
Medical Devices: Patient monitors, Infusion pumps, Diagnostic equipment
Automotive: Telematics units, ADAS, In-vehicle infotainment
Smart Energy: Smart meters, Grid sensors, Energy storage systems

Case Study: DS3231 RTC in solar inverters maintains time-stamped energy production logs during grid outages.

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Analog Devices	ADT74x	0.5ppm accuracy, I2C interface
Maxim Integrated	DS3231	Integrated TCXO, 2ppm
STMicroelectronics	M41T82	Auto-calibration, 256Hz output
NXP Semiconductors	PCF8523	Low-cost I2C, 1.8V operation
Texas Instruments	RV-8263-C3	3V lithium-backed, alarm functions

7. Selection Guidelines

Key considerations:

Accuracy requirements ( 2ppm vs 20ppm)
Interface compatibility (I2C vs SPI vs parallel)
Power budget (active vs standby current)
Environmental conditions (temperature, vibration)
Package size vs PCB space limitations
Battery backup vs capacitor-based solutions
Additional features (alarms, square wave outputs)

Example: For wearables: prioritize ultra-low power (M41T94 @ 600nA) with small TSSOP package.

8. Industry Trends

Emerging trends include:

Integration with MEMS oscillators replacing traditional crystals
Advancements in temperature compensation algorithms ( 0.1ppm achievable)
System-in-Package (SiP) solutions combining RTC with sensors
Increased adoption in edge computing devices for timestamped data processing
Automotive-grade RTCs for autonomous vehicle synchronization

Market drivers: Growth in IoT devices (projected 12% CAGR 2023-2030) and industrial automation systems.