Clock/Timing - Application Specific

Image	Part Number	Description / PDF	Quantity	Rfq
	MAX24210EXG2 Roving Networks / Microchip Technology	IC CLK SYNTHESIZER 10OUT 81CSBGA	0
	ZL30150GGG2 Roving Networks / Microchip Technology	IC CLK TRANSLATOR 2CH 100FBGA	0
	ZL30160GGG2 Roving Networks / Microchip Technology	IC CLK TRANSLATOR 4CH 100FBGA	0
	ZL30364GDG2 Roving Networks / Microchip Technology	IC NETWORK SYNCH ETH CLK 144LBGA	0
	ZL30791LFG7 Roving Networks / Microchip Technology	SINGLE CHANNEL 1588 TIMING CARD	0
	ZL30342GGG2 Roving Networks / Microchip Technology	IC SYNCE/SONET/SDH 144CABGA	0
	ZL30703LDG6 Roving Networks / Microchip Technology	TRIPLE CHANNEL IEEE1588 SYNCHRON	0
	E1466DHO-S8G3Y Roving Networks / Microchip Technology	IC CLOCK 32KHZ DGTL-TRIM 8SOIC	0
	MAX3638ETM2 Roving Networks / Microchip Technology	IC PLL CLOCK GEN LO JITT 48TQFN	0
	U2102B-M Roving Networks / Microchip Technology	IC TIMER MULTI IGBT/MOSF 16-DIP	0
	SY87701VHH-TR Roving Networks / Microchip Technology	IC CLOCK/DATA RECOVERY 32-TQFP	0
	MAX3624AETJ2T Roving Networks / Microchip Technology	IC CLOCK GENERATOR PREC 32TQFN	0
	SY87702LHI Roving Networks / Microchip Technology	IC CLK DATA REC SDH 2.5GBPS	0
	DSC557-0334SI1T Roving Networks / Microchip Technology	MEMS OSC XO 100.0000MHZ HCSL LVD	0
	MAX3679AETJ2 Roving Networks / Microchip Technology	IC CLOCK GENERATOR 32TQFN	0
	SY897132LKY Roving Networks / Microchip Technology	IC CLK LINK REPLICATOR HDTV	0
	SY87700LHG Roving Networks / Microchip Technology	IC CLK DATA REC SDH 175MBPS	0
	DSC557-0333FE0 Roving Networks / Microchip Technology	MEMS OSC XO 100.0000MHZ LVDS SMD	0
	ZL30107GGG Roving Networks / Microchip Technology	IC SYNCHRONIZER ETH SGL 64CABGA	0
	MDB1900ZCQZ Roving Networks / Microchip Technology	BUFFER 19-OUTPUT	0

Clock/Timing - Application Specific

1. Overview

Application-Specific Clock/Timing ICs are specialized semiconductor devices designed to generate, distribute, and manage precise timing signals for targeted system requirements. Unlike general-purpose timing solutions, these ICs integrate optimized architectures for specific performance metrics such as ultra-low jitter, high-frequency stability, or specialized synchronization protocols. They play a critical role in ensuring system reliability, data integrity, and operational efficiency across modern electronics, from telecommunications infrastructure to automotive control systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Real-Time Clocks (RTC)	Low-power timekeeping with calendar functions, often integrated with memory	Computers, smart meters, medical devices
Clock Generators	Multi-output frequency synthesis with programmable phase alignment	Networking equipment, FPGAs, servers
Jitter Attenuators	Phase noise reduction using advanced PLL architectures	5G base stations, high-speed transceivers
Fanout Buffers	Signal replication with skew control and impedance matching	Industrial automation, PCIe systems
Clock Controllers	Dynamic frequency switching and redundancy management	Automotive ADAS, aerospace systems

3. Structure and Composition

Typical devices feature:

Package Types: QFN, BGA, TSSOP (sizes from 2x2mm to 14x14mm)
Core Components: Crystal oscillator interface, fractional-N PLL, programmable dividers, LVDS/CML output drivers
Specialized Circuits: Spread-spectrum control, failover multiplexers, temperature compensation modules
Power Management: Multiple voltage domains, low-dropout regulators for analog/digital isolation

4. Key Technical Specifications

Parameter	Significance	Typical Values
Frequency Range	Determines application suitability	1kHz 1GHz
Phase Jitter (RMS)	Impacts signal integrity in high-speed systems	50fs 5ps
Power Supply Range	Affects system design flexibility	1.8V 5.5V
Operating Temperature	Defines environmental robustness	-40 C to +125 C
Phase Noise @1MHz Offset	Critical for RF/wireless applications	-155dBc/Hz

5. Application Fields

Telecommunications: 5G massive MIMO arrays, optical transceivers
Industrial: Programmable logic controllers (PLCs), precision test equipment
Automotive: Advanced driver assistance systems (ADAS), vehicle networking
Consumer Electronics: High-resolution displays, AR/VR headsets

6. Leading Manufacturers and Products

Vendor	Product Series	Key Features
TI (Texas Instruments)	CDCM62xx	3.2GHz clock generator with 50fs jitter
STMicroelectronics	M41Txx RTC	2ppm accuracy with embedded EEPROM
Microchip Technology	ZL303xx	IEEE 1588 boundary clock synchronization
Analog Devices	HMC7044	14-output jitter attenuator for RF systems

7. Selection Guidelines

Application Requirements: Prioritize jitter specifications for communications vs. power consumption for portable devices
Frequency Precision: Use MEMS-based oscillators for vibration resistance in automotive applications
Environmental Factors: Select industrial-grade (-40 to +85 C) for outdoor equipment
Integration Level: Combine clock generation + buffering in single chip for space-constrained designs
Compliance: Verify automotive (AEC-Q100), aerospace (ECSS) certifications

8. Industry Trends

Emerging directions include:

Integration of AI-driven phase calibration algorithms
Development of chip-scale atomic clock (CSAC) technology for sub-ppb stability
Adoption of 3D packaging to minimize parasitic capacitance
Increasing demand for multi-standard timing solutions (5G+GNSS+Ethernet)
Growth of energy-harvesting RTC ICs for IoT edge devices