Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R40-6000302

R40-6000302

Harwin

ROUND SPACER M4 BRASS 3MM

0

R44-1001602

R44-1001602

Harwin

HEX STANDOFF #4-40 BRASS 16MM

0

R30-4002502

R30-4002502

Harwin

HEX STANDOFF M3X0.5 BRASS 25MM

0

R25-1002502

R25-1002502

Harwin

HEX STNDFF M2.5X0.45 BRASS 25MM

0

R30-4002002

R30-4002002

Harwin

HEX STANDOFF M3X0.5 BRASS 20MM

0

R40-6001302

R40-6001302

Harwin

ROUND SPACER M4 BRASS 13MM

0

R30-1011702

R30-1011702

Harwin

HEX STANDOFF M3X0.5 BRASS 17MM

0

R25-1000502

R25-1000502

Harwin

HEX STANDOFF M2.5X0.45 BRASS 5MM

0

R30-1612500

R30-1612500

Harwin

HEX STANDOFF M3X0.5 NYLON 25MM

0

R30-4001602

R30-4001602

Harwin

HEX STANDOFF M3X0.5 BRASS 16MM

0

R30-1010502

R30-1010502

Harwin

HEX STANDOFF M3X0.5 BRASS 5MM

0

R30-4000802

R30-4000802

Harwin

HEX STANDOFF M3X0.5 BRASS 8MM

0

R25-1001102

R25-1001102

Harwin

HEX STNDFF M2.5X0.45 BRASS 11MM

0

R30-3002102

R30-3002102

Harwin

HEX STANDOFF M3X0.5 BRASS 21MM

0

R30-3005002

R30-3005002

Harwin

HEX STANDOFF M3X0.5 BRASS 50MM

0

R30-3001702

R30-3001702

Harwin

HEX STANDOFF M3X0.5 BRASS 17MM

0

R6391-02

R6391-02

Harwin

HEX STANDOFF M3X0.5 BRASS 1/4"

0

R30-4000902

R30-4000902

Harwin

HEX STANDOFF M3X0.5 BRASS 9MM

0

R25-3000302

R25-3000302

Harwin

HEX STANDOFF M2.5X0.45 BRASS 3MM

0

R30-3011302

R30-3011302

Harwin

HEX STANDOFF M3X0.5 BRASS 13MM

0

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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