Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
M1259-3005-AL

M1259-3005-AL

RAF

HEX STANDOFF M3X0.5 ALUM 12MM

4641

M2145-4007-AL

M2145-4007-AL

RAF

HEX STANDOFF M4X0.7 ALUM 10MM

8

2108-632-AL

2108-632-AL

RAF

HEX STANDOFF #6-32 ALUMINUM 3/4"

1685

4500-632-AL

4500-632-AL

RAF

HEX STANDOFF #6-32 ALUM 3/16"

196

M0597-4-N

M0597-4-N

RAF

8MM RD X 8MM X 4.3MM ID

499

M0542-3-N

M0542-3-N

RAF

ROUND SPACER NYLON 13MM

1484

M2103-3005-SS

M2103-3005-SS

RAF

HEX STANDOFF M3X0.5 SS 8MM

2719

M1274-3005-S-12

M1274-3005-S-12

RAF

4.5MM HEX X 31MM X M3 THD

300

NAS1829C3A13

NAS1829C3A13

RAF

STAINLESS STEEL 3/16 HEX MALE/FE

0

4067-440-AL

4067-440-AL

RAF

1/4 RD X 3-1/4 LENGTH

289

4009-632-SS

4009-632-SS

RAF

3/16 RD X 3/4 LENGTH

744

4537-632-AL-7

4537-632-AL-7

RAF

HEX STANDOFF #6-32 ALUM 11/16"

24716

NAS1829C4C09

NAS1829C4C09

RAF

STAINLESS STEEL 1/4 HEX MALE/FEM

250

M0602-5-AL

M0602-5-AL

RAF

8MM RD X 13MM X 5.3MM ID

1994

2060-440-S-12

2060-440-S-12

RAF

3/16 HEX X 11/16 LENGTH

1459

4533-832-AL

4533-832-AL

RAF

1/4 HEX X 7/16 LENGTH

1045

4662-632-B

4662-632-B

RAF

3/8_HEX_MALE_FEMALE_STANDOFFS

484

4034-632-SS

4034-632-SS

RAF

1/4 RD X 1/2 LENGTH

300

4541-632-AL

4541-632-AL

RAF

1/4 HEX X 15/16 LENGTH

450

4521-440-AL

4521-440-AL

RAF

3/16 HEX X 1-1/2 LENGTH

227

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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