Board Spacers, Standoffs

Part Number	Description / PDF	Quantity
2110-632-AL RAF	HEX STANDOFF #6-32 ALUMINUM 7/8"	322
MF-200-UC06-SL20300 Aearo Technologies, LLC – a 3M company	RND STANDOFF #6-32 SYN RUB 1/2"	985
36M35MF020 Richco, Inc. (Essentra Components)	MALE FEMALE THREADED STANDOFF, M	340
2270-2 Keystone Electronics Corp.	HEX STANDOFF #4-40 BRASS 1/8"	1505100
M1263-3005-S-12 RAF	HEX STANDOFF M3X0.5 STEEL 16MM	631
QSPR-02 Samtec, Inc.	ROUND SPACER QXX SERIES	1082
M0904-B-25-AL RAF	ROUND SPACER ALUMINUM 5MM	1518
SWI2020A Richco, Inc. (Essentra Components)	ROUND SPACER M12 NYLON 3/8"	1725
1002-080-SS-20 RAF	5/16OD X 8-32 THD	0
13ME129 Richco, Inc. (Essentra Components)	ROUND SPACER, 13.3MM ID, 25MM OD	1000
13RSSR0357 Richco, Inc. (Essentra Components)	ROUND SPACER, 1.005 ID, 1.500 OD	250
M0599-3-SS RAF	8MM RD X 10MM X 3.2MM ID	338
NAS61-02B-009 RAF	NYLON UNTHREADED SPACER .178-.19	0
14HTSP010 Richco, Inc. (Essentra Components)	HEX THREADED STANDOFF, #6-32 THR	9990
1678T-832-B RAF	1/4_ROUND_FEMALE_STANDOFFS	1500
13RS018721 Richco, Inc. (Essentra Components)	ROUND SPACER, .063 ID, .187 OD,	4990
CBTS020A Richco, Inc. (Essentra Components)	HEX STANDOFF M3 NYLON 7MM	3930
13RS061019 Richco, Inc. (Essentra Components)	ROUND SPACER, .325 ID, .615 OD,	2000
R30-6701594 Harwin	ROUND SPACER M3 NYLON 15MM	642
NAS1829C4G24 RAF	STAINLESS STEEL 1/4 HEX MALE/FEM	0

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Cylindrical Spacers	Simple tubular design with uniform diameter	PCB layer separation in consumer electronics
Hexagonal Standoffs	6-sided structure for wrench tightening	Industrial equipment panel mounting
Self-clinching Standoffs	Permanent installation with threaded compression	Sheet metal enclosures in servers
Adjustable Spacers	Variable length through threaded adjustment	Prototype development and testing
Insulated Spacers	Non-conductive materials for electrical isolation	High-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

Parameter	Importance
Material Hardness (HV)	Determines wear resistance and load capacity
Thread Engagement Length	Affects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)	Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)	Safety factor in high-voltage applications
Installation Torque Rating	Prevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

Electronics Manufacturing: Server racks, LED displays
Automotive: Engine control units (ECUs), ADAS systems
Aerospace: Satellite PCB mounting, avionics enclosures
Medical Devices: MRI scanner internal structures
Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

Manufacturer	Representative Product
PEM	S-8900 Series self-clinching standoffs
RS Components	486-8826 insulated hexagonal spacers
Mouser Electronics	925206-12 adjustable PCB spacers
McMaster-Carr	91285A102 stainless steel standoffs

7. Selection Recommendations

Evaluate mechanical load requirements vs material strength
Match thread type (UNC/UNF/Metric) with assembly hardware
Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
Select insulated variants for >50V circuits
Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

Miniaturization: Sub-1mm spacers for wearable devices
Material Innovation: Conductive polymer composites for EMI shielding
Smart Integration: Standoffs with embedded strain gauges for structural monitoring
Automated Installation: Self-aligning designs for robotic assembly lines
Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production