Board Spacers, Standoffs

Part Number	Description / PDF	Quantity
CBSS015A Richco, Inc. (Essentra Components)	SELF RETAINING SPACER, .187 IN T	1933
1101-2-SS RAF	1/8 RD X 3/16 X .090 ID	1496
M2125-3005-AL RAF	4.5MM HEX X 40MM X M3 THD	128
4550-832-S-12 RAF	HEX STANDOFF #8-32 STEEL 1-1/2"	452
13RS036033 Richco, Inc. (Essentra Components)	ROUND SPACER, .200 ID, .350 OD,	4986
4550-832-SS RAF	1/4 HEX X 1-1/2 LENGTH	136
13RS162591 Richco, Inc. (Essentra Components)	ROUND SPACER, .680 ID, 1.062 OD,	500
971080474 Würth Elektronik Midcom	BRASS SPACER STUD METRIC THREAD	1089
M0502-3-AL RAF	ROUND SPACER ALUMINUM 3MM	1506
13RS035453 Richco, Inc. (Essentra Components)	ROUND SPACER, .172 ID, .354 OD,	1726
1452A Keystone Electronics Corp.	HEX STANDOFF #8-32 BRASS 7/16"	5001800
MFTS6-4-48 Richco, Inc. (Essentra Components)	HEX STANDOFF #6-32 NYLON 1/4"	0
970100324 Würth Elektronik Midcom	BRASS SPACER STUD METRIC THREAD	1016
35HSP002 Richco, Inc. (Essentra Components)	HEX SELF THREAD STANDOFF, #4 SCR	1970
13RS018784 Richco, Inc. (Essentra Components)	ROUND SPACER, .104 ID, .187 OD,	4942
2103-632-S-12 RAF	1/4 HEX X 7/16 LENGTH	1500
MB-400-UC31-H Aearo Technologies, LLC – a 3M company	RND STNDFF 5/16"-18 SYN 3/4" 1PC	78
4616-1032-SS RAF	5/16 HEX X 5-1/4 LENGTH	436
1188-10-AL RAF	ROUND SPACER ALUMINUM 3/8"	466
14MMHTSP015 Richco, Inc. (Essentra Components)	HEX THREADED STANDOFF, M4 THREAD	1000

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Cylindrical Spacers	Simple tubular design with uniform diameter	PCB layer separation in consumer electronics
Hexagonal Standoffs	6-sided structure for wrench tightening	Industrial equipment panel mounting
Self-clinching Standoffs	Permanent installation with threaded compression	Sheet metal enclosures in servers
Adjustable Spacers	Variable length through threaded adjustment	Prototype development and testing
Insulated Spacers	Non-conductive materials for electrical isolation	High-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

Parameter	Importance
Material Hardness (HV)	Determines wear resistance and load capacity
Thread Engagement Length	Affects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)	Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)	Safety factor in high-voltage applications
Installation Torque Rating	Prevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

Electronics Manufacturing: Server racks, LED displays
Automotive: Engine control units (ECUs), ADAS systems
Aerospace: Satellite PCB mounting, avionics enclosures
Medical Devices: MRI scanner internal structures
Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

Manufacturer	Representative Product
PEM	S-8900 Series self-clinching standoffs
RS Components	486-8826 insulated hexagonal spacers
Mouser Electronics	925206-12 adjustable PCB spacers
McMaster-Carr	91285A102 stainless steel standoffs

7. Selection Recommendations

Evaluate mechanical load requirements vs material strength
Match thread type (UNC/UNF/Metric) with assembly hardware
Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
Select insulated variants for >50V circuits
Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

Miniaturization: Sub-1mm spacers for wearable devices
Material Innovation: Conductive polymer composites for EMI shielding
Smart Integration: Standoffs with embedded strain gauges for structural monitoring
Automated Installation: Self-aligning designs for robotic assembly lines
Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production