Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
KMZ1608SHR102ATD25 TDK Corporation	FERRITE BEAD 1 KOHM 0603 1LN	1739
MMZ1608Q121BTA00 TDK Corporation	FERRITE BEAD 120 OHM 0603 1LN	2700
MMZ1005S182ET000 TDK Corporation	FERRITE BEAD 1.8 KOHM 0402 1LN	168770
MMZ1608R150ATD25 TDK Corporation	FERRITE BEAD 15 OHM 0603 1LN	3071
MMZ1608D220CTDH5 TDK Corporation	FERRITE BEAD 22 OHM 0603 1LN	0
MMZ1608A252BTD25 TDK Corporation	FERRITE BEAD 2.5 KOHM 0603 1LN	13213
MMZ1005Y601CT000 TDK Corporation	FERRITE BEAD 600 OHM 0402 1LN	23271
MPZ1608D600BTA00 TDK Corporation	FERRITE BEAD 60 OHM 0603 1LN	8095
MMZ1608Y102CTA00 TDK Corporation	FERRITE BEAD 1 KOHM 0603 1LN	0
MMZ0603S601CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	29490
MMZ2012R601AT000 TDK Corporation	FERRITE BEAD 600 OHM 0805 1LN	71727
MPZ0402S330CT000 TDK Corporation	FERRITE BEAD 33 OHM 01005 1LN	39650
MMZ1005B800CT000 TDK Corporation	FERRITE BEAD 80 OHM 0402 1LN	7646
MPZ1005S300CT000 TDK Corporation	FERRITE BEAD 30 OHM 0402 1LN	530593
VAF201610FA-841-1 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	5790
MPZ1608S101ATDH5 TDK Corporation	FERRITE BEAD 100 OHM 0603 1LN	21699
MPZ1005A331ET000 TDK Corporation	FERRITE BEAD 330 OHM 0402 1LN	9720
MMZ1005Y241CTD25 TDK Corporation	FERRITE BEAD 240 OHM 0402 1LN	2487
MMZ2012R601ATD25 TDK Corporation	FERRITE BEAD 600 OHM 0805 1LN	6171
MMZ1005A601ETD25 TDK Corporation	FERRITE BEAD 600 OHM 0402 1LN	7260

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems