Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MMZ1608Y751BTD25 TDK Corporation	FERRITE BEAD 750 OHM 0603 1LN	6594
MPZ1005Y900CTD25 TDK Corporation	FERRITE BEAD 90 OHM 0402 1LN	0
MMZ1608Q221BTD25 TDK Corporation	FERRITE BEAD 220 OHM 0603 1LN	3114
MPZ1005AFZ100NT000 TDK Corporation	FERRITE BEAD 10 OHM 0402 1LN	1905
MMZ1005S102CT000 TDK Corporation	FERRITE BEAD 1 KOHM 0402 1LN	156494
MMZ1608S601CTAH0 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	5317
MMZ1608S181CTAH0 TDK Corporation	FERRITE BEAD 180 OHM 0603 1LN	2970
MMZ1608Q601BTA00 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	9087
MMZ1005Y301CTD25 TDK Corporation	FERRITE BEAD 300 OHM 0402 1LN	6859
MMZ0603Y241CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	30000
MAF1608GAD471LTAH0 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	7625
MMZ2012D800BTD25 TDK Corporation	FERRITE BEAD 80 OHM 0805 1LN	1558
MMZ1005S601ET000 TDK Corporation	FERRITE BEAD 600 OHM 0402 1LN	28510
HF30ACB201209-T TDK Corporation	FERRITE BEAD 7 OHM 0805 1LN	1018
MPZ0603S800HT000 TDK Corporation	CHIP BEADS FOR GENERAL SIGNAL LI	19998
MMZ2012S800AT000 TDK Corporation	FERRITE BEAD 80 OHM 0805 1LN	20
MPZ2012S601AT000 TDK Corporation	FERRITE BEAD 600 OHM 0805 1LN	32917
MPZ1005S331ETD25 TDK Corporation	FERRITE BEAD 330 OHM 0402 1LN	26240
MPZ1608Y151BTA00 TDK Corporation	FERRITE BEAD 150 OHM 0603 1LN	138322
MMZ1608S121CTAH0 TDK Corporation	FERRITE BEAD 120 OHM 0603 1LN	6882

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems