Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
BKP0603TM330-T TAIYO YUDEN	FERRITE BEAD 33 OHM 0201	3775
HF50ACC575032-T TDK Corporation	FERRITE BEAD 400 OHM 2220 1LN	3750
MMZ1005D221ETD25 TDK Corporation	FERRITE BEAD 220 OHM 0402 1LN	5557
BLM18KG331WH1D TOKO / Murata	FB SMD 0603INCH 330OHM POWRTRNAU	2490
Z0402C220CSMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	10000
EXC-28BB121U Panasonic	FERRITE BEAD 120 OHM 0804 4LN	5360
MMZ1608F030BTA00 TDK Corporation	FERRITE BEAD 3 OHM 0603 1LN	7884
LI0402B800R-10 Laird - Performance Materials	FERRITE BEAD 80 OHM 0402 1LN	40774
Z0603C300GPWZT KEMET	POWER LINE HIGH IMPEDANCE FERRIT	3690
BK2125HM102-T TAIYO YUDEN	FERRITE BEAD 1 KOHM 0805 1LN	2352
BBBK00160808601Y00 Chilisin Electronics	EMI BEAD FILETER	6052
MMZ1005Y800CTD25 TDK Corporation	FERRITE BEAD 80 OHM 0402 1LN	10000
742792603 Würth Elektronik Midcom	FERRITE BEAD 28 OHM 0603 1LN	49600
FBMH3216HM501NT TAIYO YUDEN	FERRITE BEAD 500 OHM 1206 1LN	18632
MMZ1608R600ATA00 TDK Corporation	FERRITE BEAD 60 OHM 0603 1LN	20028
742843122 Würth Elektronik Midcom	FERRITE BEAD 220 OHM 0402 1LN	18575
MFBM1V1005-300-R PowerStor (Eaton)	FIXED IND 30 1300MA 0402	3000
MFBM1V1005-201-R PowerStor (Eaton)	FIXED IND 200 700MA 0402	2990
BK1005HM121-TV TAIYO YUDEN	FERRITE BEAD 120 OHM 0402 1LN	3484
B-01-A KEMET	BEAD (LEAD), 2OHM, 5A	548

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems